Copper conductor compositions containing copper oxide and Bi.sub.2 O.sub.3

• US 4,172,919 A
• Filed: 06/16/1978
• Issued: 10/30/1979
• Est. Priority Date: 04/22/1977
• Status: Expired due to Term

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Mitchell, James D.
• Primary Examiner(s): Padgett, Benjamin R.
• Application Number:
  US05/916,158
• Time in Patent Office: 501 Days
• Field of Search: 252/512, 106/1, 106/1.13, 106/1.18, 106/1.23, 106/1.26, 428/209, 428/432, 428/433
• US Class Current: 428/209
• CPC Class Codes: H01B 1/16 the conductive material comprising metals or alloys
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

Compositions useful for making electrical conductor patterns on a nonconductive (dielectric) substrate, the compositions comprising certain proportions of finely divided copper, copper oxide and glass powders, dispersed in a vehicle. The compositions may be printed on a substrate and fired in a neutral atmosphere to produce conductor patterns adherent to the substrate.

Claims

1. A copper conductor composition fireable in a neutral atmosphere to produce a solderable, adherent conductor pattern on a dielectric substrate, said composition comprising finely divided inorganic particles dispersed in an inert liquid vehicle, said inorganic particles consisting essentially of, by weight,

(a) 86-97% copper,

(b) 1-7% copper oxide,

(c) 1-7% glass comprising 75% or more of Bi₂ O₃,

the total weight of (b) and (c) being in the range 3-14%, provided that where the total weight of (b) and (c) is 3%, it is of 2% (b) and 1% (c).

2. A composition according to claim 1 of 90-97% (a), 1-7% (b), and 1-7% (c).

3. A composition according to claim 1 wherein the total weight of (b) and (c) is in the range 3-11%.

4. A composition according to claim 2 wherein the total weight of (b) and (c) is in the range 3-11%.

5. A composition according to claim 1 wherein glass (c) comprises at least 80% of Bi₂ O₃.

6. A composition according to claim 3 wherein glass (c) comprises at least 80% Bi₂ O₃.

7. A composition according to claim 1 wherein (b) is Cu₂ O.

8. A composition according to claim 1 wherein (b) is CuO.

9. A composition according to claim 1 of 80-90% said inorganic particles and 10-20% said inert liquid vehicle.

10. A composition according to claim 1 of about 93% (a), 3.5% (b), and 3.5% (c).

11. A dielectric substrate having adherent thereto a sintered composition of the inorganic particles of claim 1.

12. A dielectric substrate having adherent thereto a sintered composition of the inorganic particles of claim 2.

13. A dielectric substrate having adherent thereto a sintered composition of the inorganic particles of claim 10.