Electronic assembly with heat sink means
First Claim
1. An electronic assembly consisting of at least a pair of modules interconnected by means permitting ease of assembly and disassembly, one of said modules comprising a pair of spaced heat sinks, a printed circuit board mounted by first bracket support means between said heat sinks, electronic components on the upper face of said printed circuit board including high heat generating elements supported by said first bracket support means along side edges of said printed circuit board in close proximity to said heat sinks, the other module including a base underlying said printed circuit board and mounting electronic components on a face thereof and second bracket means carried by said heat sinks and secured to said base, said heat sinks thereby forming side enclosures for said assembly.
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Accused Products
Abstract
An electronic assembly consisting of at least a pair of modules, a control and power semiconductor module and a filter module interconnected by means permitting ease of assembly and disassembly. The control and power semiconductor module comprises a pair of spaced heat sinks forming side enclosures for the assembly and connected by bracket means to a printed circuit board (PCB) which mounts electronic components on its upper face including high heat generating elements carried by the bracket means. The PCB is located at one end of the heat sinks which is secured at their other end to the base of the filter module. The large capacitors and reactors supported on the base nest in the chamber or cavity formed by the PCB and heat sinks to provide a compact assembly.
52 Citations
5 Claims
- 1. An electronic assembly consisting of at least a pair of modules interconnected by means permitting ease of assembly and disassembly, one of said modules comprising a pair of spaced heat sinks, a printed circuit board mounted by first bracket support means between said heat sinks, electronic components on the upper face of said printed circuit board including high heat generating elements supported by said first bracket support means along side edges of said printed circuit board in close proximity to said heat sinks, the other module including a base underlying said printed circuit board and mounting electronic components on a face thereof and second bracket means carried by said heat sinks and secured to said base, said heat sinks thereby forming side enclosures for said assembly.
Specification