Process for fabricating thin film and glass sheet laminate

• US 4,179,324 A
• Filed: 11/28/1977
• Issued: 12/18/1979
• Est. Priority Date: 11/28/1977
• Status: Expired due to Term

• Current Assignee: Spire Corporation
• Original Assignee: Spire Corporation
• Inventors: Kirkpatrick, Allen R.
• Primary Examiner(s): Drummond, Douglas J.
• Application Number:
  US05/855,418
• Time in Patent Office: 750 Days
• Field of Search: 156/272, 156/230, 156/289, 156/247, 156/249, 156/344
• US Class Current: 156/230
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A semiconductor thin film and glass stratum laminate is formed by depositing a semiconductor thin film onto a temporary substrate having a carbon coating to which the film adheres. Processing of the semiconductor thin film for selected performance characteristics is accomplished while the film is affixed to the temporary substrate. The processed thin film is transferred and electrostatically bonded to the glass stratum by exposure to a thermal environment at or below the softening point of the glass stratum and by application of an electric potential across the thin film and glass. The bonded thin film and glass stratum laminate is separated from the temporary substrate.

Claims

1. A method for fabricating a thin film and glass stratum laminate comprising the steps of:

(a) depositing applying thin film material onto a temporary substrate by a deposition process;

(b) superposing a glass stratum on said thin film;

(c) exposing said superposed glass stratum and thin film to a thermal environment which does not exceed the softening point of said glass stratum;

(d) electrostatically bonding said glass stratum and said thin film; and

(e) removing said temporary substrate from said bonded thin film and glass stratum laminate structure.

2. The method as claimed in claim 1 including the step of coating said temporary substrate with a release layer, said thin film deposited onto said release layer.

3. The method as claimed in claim 1 wherein said glass stratum and said processed thin film material are electrostatically bonded together while exposed to said thermal environment.

4. The method as claimed in claim 3 wherein said electrostatic bonding includes the steps of exposing said processed thin film material and said glass stratum to a thermal environment in the range of 300°

C. to the softening point of said glass stratum, applying an electric potential across said superposed glass stratum and processed thin film, and applying a pressure in the range of 100 to 1000 psi to said glass stratum and thin film.

5. The method as claimed in claim 4 wherein said electric potential is in the range of 100 volts to 10,000 volts, said glass stratum biased negatively with respect to said deposited thin film material.

6. A method for fabricating a semiconductor thin film and glass stratum laminate comprising the steps of:

(a) coating a temporary substrate with a release layer;

(b) depositing a semiconductor thin film onto said release layer;

(c) processing said semiconductor thin film;

(d) superposing a glass stratum on said deposited semiconductor thin film;

(e) electrostatically bonding said glass stratum to said processed semiconductor thin film in a thermal environment which does not exceed the softening point of said glass stratum; and

(f) separating said temporary substrate from said electrostatically bonded glass stratum and semiconductor film laminate.

7. The method as claimed in claim 6 including the step of exposing said deposited thin film to selected conditions which exceed certain physical limitations of said glass stratum before superposing said glass stratum on said thin film.

8. A method for fabricating a semiconductor thin film and glass stratum laminate comprising the steps of:

(a) coating a temporary substrate with a release layer;

(b) depositing a semiconductor thin film onto said release layer;

(c) processing said semiconductor film;

(d) superposing a glass stratum on said deposited semiconductor thin film;

(e) electrostatically bonding said glass stratum to said processed semiconductor thin film in a thermal environment which does not exceed the softening point of said glass stratum; and

(f) separating said temporary substrate from said electrostatically bonded glass stratum and semiconductor film laminate;

(g) said electrostatic bonding step including the steps of exposing said processed semiconductor thin film and said glass stratum to a thermal environment in the range of 500°

C. to 700°

C., applying an electrical potential across said glass stratum and said semiconductor thin film, said glass stratum biased negatively with respect to said processed semiconductor thin film, and applying pressure in the range of 100 to 1000 psi to said semiconductor thin film and said glass stratum.

9. The method as claimed in claim 8 wherein said separating step includes cooling said temporary substrate, said release coating and said semiconductor thin film and said glass stratum composite to room temperature.

10. The method as claimed in claim 9 wherein said temporary substrate and said semiconductor thin film have substantially different thermal expansion coefficients, said semiconductor thin film separating from said temporary substrate during said cooling step.