Method of cutting hollow filaments embedded in resinous mass

• US 4,183,890 A
• Filed: 11/30/1977
• Issued: 01/15/1980
• Est. Priority Date: 11/30/1977
• Status: Expired due to Term

• Current Assignee: Permea Incorporated
• Original Assignee: Monsanto Company (Bayer AG)
• Inventors: Bollinger, Wayne A.
• Primary Examiner(s): Derrington, James H.
• Application Number:
  US05/855,846
• Time in Patent Office: 776 Days
• Field of Search: 264/159, 264/118, 264/128, 264/138, 264/139, 156/296, 427/293
• US Class Current: 264/139
• CPC Class Codes: B01D 63/021 Manufacturing thereof
• CPC Class Codes: B01D 63/023 Encapsulating materials
• CPC Class Codes: B01D 63/0233 forming the bundle

Abstract

Hollow filaments, which are suitable for use in separating one or more components from a fluid mixture by selective permeation, are embedded, or potted, in a curable resinous mass, and the resinous mass is severed to expose fluid communication openings of the hollow filaments. In accordance with the invention the curable resinous mass is sufficiently partially-cured to provide a solid mass which can be severed but does not tend to smear when severed so as to obstruct fluid communication openings of the hollow filaments; however, the partial curing is insufficient to render the severings of the resinous mass unduly difficult. The resinous mass is then severed, e.g., by cutting, to provide the fluid communication openings in the hollow filaments embedded in the resinous mass. Advantageously, the fluid communication openings of substantially all of the filaments exposed by severing the resinous mass can be essentially unobstructed, and the integrity of the filaments and the resinous mass is substantially maintained during severing. The curing of the resinous mass can be completed after severing to provide a sealing means which has high structural strength.

Claims

1. In a method for preparing a fluid separation apparatus comprising polymeric, semi-permeable hollow filaments wherein at least one end segment of each of the hollow filaments is secured in a substantially fluid-tight relationship in a sealing means comprising curable resin capable of achieving high structural strength, the improvement comprising embedding the hollow filaments in a substantially liquid, curable resin;

partially curing the resin under curing conditions which are not unduly deleterious to the hollow filaments to provide a solid, partially-cured resinous mass having the hollow filaments embedded therein, said partially-cured resinous mass having sufficient structural integrity that it can be cut without undue non-elastic flowing of the resinous mass but does not have a hardness which renders the cutting difficult;

cutting the partially-cured resinous mass generally transverse to the orientation of the hollow filaments with a sharp knife edge, said cutting exposing the bores of the hollow filaments and providing an openness of at least about 70 percent and said cutting being conducted at temperatures below those which unduly soften the hollow filaments such that the hollow filaments tend to smear closed during cutting; and

subjecting the cut, partially-cured resinous mass to curing conditions to substantially fully cure the resinous mass.

2. The method of claim 1 in which the curable resin is capable of achieving a Shore A hardness greater than about 80.

3. The method of claim 2 in which the partially-cured resinous mass has a Shore A hardness of less than about 75.

4. The method of claim 3 in which the curable resin comprises an epoxy resin.

5. The method of claim 2 in which the hardness of the face of the partially-cured resinous mass having the hollow filaments embedded therein approximates the hardness of the partially-cured resin.

6. The method of claim 5 in which the partially-cured resinous mass has a Shore A hardness of less than about 75.

7. The method of claim 6 in which the curable resin comprises an epoxy resin.

8. The method of claim 6 in which the openness is at least about 80 percent.

9. The method of claim 6 in which the maximum outside dimension of the hollow filaments is about 50 to 800 microns and the minimum wall thickness of the hollow filaments is about 5 to 300 microns.

10. The method of claim 9 in which the partially-cured resin has a Shore A hardness of at least about 55.