Substrate clamping technique in IC fabrication processes

• US 4,184,188 A
• Filed: 01/16/1978
• Issued: 01/15/1980
• Est. Priority Date: 01/16/1978
• Status: Expired due to Term

• Current Assignee: Veeco Instruments Acquisition Corporation
• Original Assignee: Veeco Instruments Incorporated
• Inventors: Briglia, Donald D.
• Primary Examiner(s): Miller, J D
• Assistant Examiner(s): Schroeder, L. C.
• Application Number:
  US05/869,523
• Time in Patent Office: 729 Days
• Field of Search: 361/230, 361/234, 269/8, 269/289 R, 269/329 WE, 250/443, 250/492 A
• US Class Current: 361/234
• CPC Class Codes: G03F 7/20 Exposure; Apparatus therefor photographic printing apparatus for making copies G03B27/00
• CPC Class Codes: H01J 37/20 Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

An electrostatic clamping technique for use in clamping substrates in various semiconductor fabrication processes is disclosed. One example takes the form of a substrate support plate which has deposited on its working face two layers of thermally conductive, electrically insulative RTV silicone, between which layers is located an interdigital type printed circuit capacitor energized by a DC source in the kilovolt range. Secured to the back surface of the support plate is a water cooled jacket with the entire assembly adapted for location in the incident ion beam and having good thermal dissipation properties.

An alternate embodiment utilized an alumina support plate on which the capacitor of aluminum composition is deposited by vacuum evaporation; the exposed capacitor surface is rendered insulative by oxidation.

Claims

1. A clamp for supporting a substrate for use in semiconductor fabrication systems comprising a thermally conductive electrically insulative support, multi-electrode capacitor means mounted on the support to establish an electric field and having at least two terminals for connection to a voltage source, and thermally conductive means oriented to electrically insulate said capacitor means from said substrate while providing thermal conductivity therebetween.

2. The clamp as defined in claim 1 in which said thermally conductive means comprise thermally conductive coating.

3. The clamp as defined in claim 1 in which said thermally conductive means comprise an oxide coating on said capacitor means.

4. The clamp as defined in claim 1 in which said support comprises an electrically conductive metallic layer coated with a thermally conductive silicon material.

5. The clamp as defined in claim 1 in which said support comprises a plate fabricated of an electrically insulative, thermally conductive material.

6. The clamp of claim 5 in which said material is alumina.

7. The clamp of claim 6 in which said capacitor means are comprised of aluminum and in which said thermally conductive means comprise an oxide coating on said capacitor means.

8. The clamp as defined in claim 1 in which said capacitor means comprise an interdigital capacitance.

9. The clamp as defined in claim 1 in which said thermally conductive means comprise a pair of layers between which is sandwiched said multi-electrode capacity means.

10. The clamp as defined in claim 1 in which the electrodes of said capacitor means are in the order of about 1 mil thickness.

11. The clamp as defined in claim 5 in which said thermally conductive means comprise two layers of thermally conductive material, each of approximately 4 mils thickness and between which said multi-electrode capacitor means is located.