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Substrate clamping technique in IC fabrication processes

  • US 4,184,188 A
  • Filed: 01/16/1978
  • Issued: 01/15/1980
  • Est. Priority Date: 01/16/1978
  • Status: Expired due to Term
First Claim
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1. A clamp for supporting a substrate for use in semiconductor fabrication systems comprising a thermally conductive electrically insulative support, multi-electrode capacitor means mounted on the support to establish an electric field and having at least two terminals for connection to a voltage source, and thermally conductive means oriented to electrically insulate said capacitor means from said substrate while providing thermal conductivity therebetween.

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