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Encapsulated Hall effect device

  • US 4,188,605 A
  • Filed: 07/21/1978
  • Issued: 02/12/1980
  • Est. Priority Date: 07/21/1978
  • Status: Expired due to Term
First Claim
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1. An encapsulated Hall effect device comprising:

  • a thin substrate with an aperture;

    a semiconductor chip, having a plurality of connection leads and including a Hall effect element having a sensing surface, said chip being disposed in registration with the aperture; and

    encapsulation material surrounding the chip and aperture, the encapsulation material comprising;

    a nonmagnetic portion of the encapsulation material surrounding the sensing surface of the chip, anda magnetically active portion of the encapsulation material surrounding the surface of the chip opposite the sensing surface, said magnetically active portion of the encapsulation material comprising a mixture of a finely divided magnetic conductor material and a binder,whereby the chip is fully enclosed by the nonmagnetic and magnetically active portions of the encapsulation material.

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