Magnetic domain packaging

• US 4,192,011 A
• Filed: 04/26/1978
• Issued: 03/04/1980
• Est. Priority Date: 04/28/1977
• Status: Expired due to Term

• Current Assignee: Radstone Technology Limited
• Original Assignee: Plessey Handel und Investments AG
• Inventors: Cooper, Paul V., Adamson, Steven J.
• Primary Examiner(s): Moffitt, James W.
• Application Number:
  US05/900,143
• Time in Patent Office: 678 Days
• Field of Search: 365/2
• US Class Current: 365/2
• CPC Class Codes: G11C 19/085 Generating magnetic fields therefor, e.g. uniform magnetic field for magnetic domain stabilisation

Abstract

A magnetic bubble device is provided comprising a substrate, a device chip and interconnecting conductors for connecting the device chip to the substrate and for supporting the device chip on the substrate so that by providing a hole in the substrate and turning over the device chip, the active surface of the device chip is arranged substantially co-planar with the top surface of the substrate, thereby enabling a reduced height device to be obtained.

Claims

1. A magnetic domain device comprising a substrate, a magnetic domain device chip, the chip having an active surface, a pair of coils each having a central axis and each coil extending around the device chip for providing a rotating magnetic field in the plane of the chip, conductive interconnecting means connecting the device chip to the substrate and arranged to support the device chip so that the active surface is substantially coplanar with a surface of the substrate and with a plane containing the central axes of the coils.

4. A magnetic domain device as claimed in claim 2, or claim 3, or claim 1, in which the substrate takes the form of a printed circuit board of a generally "W" shaped form and has an electrical conductor pattern on the top surface thereof, the device chip being attached to the conductor pattern by the interconnecting conductor means.

5. A magnetic domain device as claimed in claim 4 in which the interconnecting conductor means is provided in the form of a flexible connector frame.

6. A magnetic domain device as claimed in claim 5 in which the flexible connector frame is formed from polyimide film.

2. A magnetic domain device as claimed in claim 7 in which the substrate is provided with a recess or hole throught it in which the device chip is disposed so that the active surface thereof is substantially co-planar with the top surface of the substrate.

3. A magnetic domain device as claimed in claim 7 in which the device chip is secured to the interconnecting conductor means and the interconnecting conductor means is secured to the substrate so that the device chip is mounted in "flip chip" configuration with its active surface in close proximity with the top surface of the substrate so as to be substantially co-planar therewith.