Method of chemically vapor-depositing a low-stress glass layer
First Claim
1. In a method of chemically vapor-depositing a glass layer onto a substrate wherein said substrate is heated in an atmosphere comprising silane and oxygen to a temperature such that said silane is oxidized, the improvement in said method comprising the step of adding water vapor to said atmosphere to increase the water vapor content of said atmosphere substantially above that normally present therein from the oxidation of said silane, whereby the tensile stress of said deposited glass layer is reduced.
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Abstract
A method of chemically vapor-depositing a low-stress glass layer onto a substrate which is heated in an atmosphere including silane, oxygen, and an inert carrier gas, comprises the step of adding water vapor to the atmosphere to increase the water vapor content of the atmosphere substantially above that normally present therein from the oxidation of the silane.
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Citations
16 Claims
- 1. In a method of chemically vapor-depositing a glass layer onto a substrate wherein said substrate is heated in an atmosphere comprising silane and oxygen to a temperature such that said silane is oxidized, the improvement in said method comprising the step of adding water vapor to said atmosphere to increase the water vapor content of said atmosphere substantially above that normally present therein from the oxidation of said silane, whereby the tensile stress of said deposited glass layer is reduced.
- 15. A method of chemically vapor depositing a glass layer onto a surface of a substrate comprising heating said substrate while contacting said surface with a vaporous mixture comprising silane, oxygen, and water vapor, said water vapor being present in an amount substantially above that normally present therein from the oxidation of said silane, whereby the tensile stress of said deposited glass layer is reduced.
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