Inductance fabricated on a metal base printed circuit board
First Claim
1. A high-Q inductance for a metallic base printed circuit board, comprising:
- a printed circuit board metallic support base;
a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux;
an overlayer of insulating material deposited on said metallic support base for providing electrical insulation from said metallic support base;
an electrically conductive printed coil structure deposited on said overlayer and located about said ferromagnetic core for generating said time varying magnetic flux,said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths.
1 Assignment
0 Petitions
Accused Products
Abstract
A high-Q printed circuit board inductance comprises a ferromagnetic core placed through an aperture of a metallic support base of a printed circuit board. The ferromagnetic core provides a preferred path for time-varying magnetic flux. An overlayer of insulating material such as porcelain enamel is interposed between a planar printed coil structure located about the ferromagnetic core and the metallic support base. A gap is formed in the metallic support base and extends outwardly from the aperture in a manner intersecting closed paths within the metallic support base that are linked by the time-varying magnetic flux. A high-Q inductance is formed because the flow of eddy currents in the closed paths is substantially impeded across the gap.
71 Citations
14 Claims
-
1. A high-Q inductance for a metallic base printed circuit board, comprising:
-
a printed circuit board metallic support base; a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux; an overlayer of insulating material deposited on said metallic support base for providing electrical insulation from said metallic support base; an electrically conductive printed coil structure deposited on said overlayer and located about said ferromagnetic core for generating said time varying magnetic flux, said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 12, 13)
-
-
8. A high-Q inductance for a metallic base printed circuit board, comprising:
-
a printed circuit board metallic support base; a ferromagnetic core placed through a first aperture in said metallic support base for providing a preferred path in said ferromagnetic core for time-varying magnetic flux; an electrically conductive printed coil structure located about said ferromagnetic core for generating said time-varying magnetic flux; an overlayer of insulating material interposed between a first spiral coil of said printed coil structure and said metallic support base for providing electrical insulation from said metallic support base; and a second layer of insulating material deposited on a surface of said metallic support base opposite said overlayer, said second layer being interposed between a second spiral coil of said printed coil structure and said metallic support base, said metallic support base including a gap extending outwardly from the vicinity of said first aperture in a manner that will intersect closed paths within said metallic support base that are linked by said time-varying magnetic flux for forming a high-Q inductance by substantially impeding across said gap the flow of dissipative eddy currents in said closed paths. - View Dependent Claims (9, 10, 11)
-
-
14. A printed circuit board inductance, comprising:
-
a printed circuit board base portion formed of an electrically conductive material; a layer of insulating material deposited on said base portion; a ferromagnetic core piece placed through an aperture in said printed circuit board base portion and said layer for providing a preferred magnetic flux path; an electrically conductive printed coil structure located about said ferromagnetic core piece and deposited on said layer of insulating material; and a source of alternating current coupled to said printed coil structure for developing a time-varying magnetic flux in said ferromagnetic core piece, said printed circuit board base portion being provided with a gap in said electrically conductive material extending from said aperture outwardly in a manner that will intersect closed paths within said electrically conductive material that are linked by said time-varying flux, said gap of sufficient width to provide a relatively large impedance to eddy currents generated in said closed paths by said time-varying magnetic flux for substantially reducing eddy current dissipation, said insulating material being deposited in said gap, at least a portion of said printed coil structure being deposited over said gap.
-
Specification