Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block

• US 4,204,246 A
• Filed: 05/08/1978
• Issued: 05/20/1980
• Est. Priority Date: 02/14/1976
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Yoshida, Takashi, Nonaka, Chiaki, Kawada, Hirohito, Arii, Hiroshi
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/903,397
• Time in Patent Office: 743 Days
• Field of Search: 165/105, 361/381, 361/385, 361/386, 361/388, 357/81, 357/82, 174/15 HP
• US Class Current: 361/699
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4056 heatsink to additional heatsink
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.

Claims

1. In a cooling assembly including a heat generating electric part having leads, a heat conductive block mounting said heat generating electric part, and a heat pipe attached to said heat conductive block for radiating the heat from said heat generating electric part to the air through said heat conductive block, the improvement in which said heatconductive block comprises a thickened portion attached to said heat pipe, and a thinned portion formed contiguously to said thickened portion, said heat generating electric part is mounted on said heat-conductive block so that at least one part of said heat generating electric part extends on the outer surface of said thinned portion, and a connector is secured to the inner surface of said thinned portion and is connected to said leads of the heat generating electric part.