Method for mounting parts on circuit boards
First Claim
1. A method for mounting one or more parts having terminals on a circuit board which comprises coating an ultraviolet-curing and thermosetting resin composition on the circuit board by screen printing with a prescribed pattern except for wiring portions of the circuit board, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the terminals of the parts onto the wiring of the circuit board.
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Abstract
One or more parts having terminals can be mounted on a circuit board by coating an ultraviolet-curing and thermosetting resin composition comprising an ultraviolet-curing resin, an addition polymerizable monomer, a photosensitizer and a heat polymerization initiator, on the circuit board by screen printing with a prescribed pattern, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the parts onto the circuit board.
101 Citations
11 Claims
- 1. A method for mounting one or more parts having terminals on a circuit board which comprises coating an ultraviolet-curing and thermosetting resin composition on the circuit board by screen printing with a prescribed pattern except for wiring portions of the circuit board, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the terminals of the parts onto the wiring of the circuit board.
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8. A method for mounting one or more parts having terminals on a circuit board which comprises coating an ultraviolet-curing and thermosetting resin composition comprising
(a) 100 parts by weight of at least one ultraviolet-curing resin selected from the group consisting of an unsaturated polyester, an unsaturated polyurethane, an epoxy acrylate resin, a 1,2-polybutadiene having terminal acryloyl, acryloyloxy, methacryloyl or methacryloyloxy groups and a molecular weight of 500 to 10,000, and a polyorganosiloxane having terminal acryloyl, acryloyloxy, methacryloyl or methacryloyloxy groups and a molecular weight of 500 to 10,000, (b) 5 to 70 parts by weight of at least one addition polymerizable monomer having at least one ethylenically unsaturated group and a boiling point of 100° - C. or more at atmospheric pressure selected from the group consisting of styrene, vinyltoluene, acrylic acid, butyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl acrylate, lauryl acrylate, methacrylic acid, ethyl methacrylate, lauryl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl methacrylate, 1,6-hexanediol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, polyethylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, diallyl phthalate and divinyl benzene,
(c) 0.05 to 5 parts by weight of a photosensitizer selected from the group consisting of benzoin, 4,4'"'"'-dimethyl benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzil, 4,4'"'"'-dimethyl benzil, benzene diazonium chloride, anthraquinone, 2-methylanthraquinone, 2-t-butylanthraquinone, 2-chloroanthraquinone, acetophenone, 4-methoxyacetophenone, diphenyl disulfide, diethyl disulfide, benzophenone and 4-methoxybenzophenone, (d) 0.05 to 5 parts by weight of a heat polymerization initiator selected from the group consisting of benzoyl peroxide, acetyl peroxide, lauroyl peroxide, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, azobisisobutyronitrile, 2,2'"'"'-azobis-2-methylbutyronitrile and 2,2'"'"'-azobis(methyl isobutyrate), on the circuit board by screen printing with a prescribed pattern except for wiring portions of the circuit board, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the terminals of the parts onto the wiring of the circuit board. - View Dependent Claims (9, 11)
- C. or more at atmospheric pressure selected from the group consisting of styrene, vinyltoluene, acrylic acid, butyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl acrylate, lauryl acrylate, methacrylic acid, ethyl methacrylate, lauryl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl methacrylate, 1,6-hexanediol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, polyethylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, diallyl phthalate and divinyl benzene,
Specification