Enhanced condensation heat transfer device and method

• US 4,216,819 A
• Filed: 02/26/1979
• Issued: 08/12/1980
• Est. Priority Date: 09/09/1976
• Status: Expired due to Term

• Current Assignee: UOP Des Plaines IL A NY General Partnership
• Original Assignee: Union Carbide Corporation (Dow, Inc.)
• Inventors: Notaro, Frank
• Primary Examiner(s): Richter, S. J.
• Application Number:
  US06/015,426
• Time in Patent Office: 533 Days
• Field of Search: 165/1, 165/110, 165/111, 165/133, 428/553, 428/559, 138/38, 138/146
• US Class Current: 165/110
• CPC Class Codes: F25J 2250/02 Bath type boiler-condenser using thermo-siphon effect, e.g. with natural or forced circulation or pool boiling, i.e. core-in-kettle heat exchanger
• CPC Class Codes: F25J 2250/04 Down-flowing type boiler-condenser, i.e. with evaporation of a falling liquid film
• CPC Class Codes: F25J 2290/44 Particular materials used, e.g. copper, steel or alloys thereof or surface treatments used, e.g. enhanced surface
• CPC Class Codes: F25J 3/04412 in a classical double column flowsheet, i.e. with thermal coupling by a main reboiler-condenser in the bottom of low pressure respectively top of high pressure column
• CPC Class Codes: F25J 5/002 for continuously recuperating cold, i.e. in a so-called recuperative heat exchanger
• CPC Class Codes: F25J 5/005 in a reboiler-condenser, e.g. within a column
• CPC Class Codes: F28D 2021/0033 for cryogenic applications air separation F25J3/04, cold heat exchange systems F25J1/0262
• CPC Class Codes: F28F 13/04 by preventing the formation of continuous films of condensate on heat-exchange surfaces, e.g. by promoting droplet formation F28F13/18 takes precedence
• CPC Class Codes: F28F 13/182 especially adapted for evaporator or condenser surfaces F28F13/187 takes precedence
• CPC Class Codes: F28F 17/005 Means for draining condensates from heat exchangers, e.g. from evaporators F28B9/08 takes precedence

Abstract

A metal substrate is provided with a single layer of randomly distributed metal bodies bonded to the substrate, spaced from each other and substantially surrounded by the substrate to form active condensation heat transfer surface and body void space.

Claims

1. A method for enhanced heat transfer between a first fluid at first inlet temperature and a second fluid at second initial temperature substantially colder than said first inlet temperature in a heat exchanger wherein said first fluid is flowed in contact with a first side of a metal substrate and at least partially condensed by the second colder fluid contacting the opposite side to said first side of said metal substrate, comprising the steps of:

providing a single layer of randomly distributed metal bodies each individually bonded to the substrate first side spaced from each other and substantially surrounded by said substrate first side so as to form body void space with the arithmetic average height e of the bodies between 0.005 inch and 0.06 inch and the body void space between 10 percent and 90 percent of the substrate first side total area; and

passing said first fluid in contact with the metal body single layer so as to form condensate on the outer portion of said metal bodies and drain the so-formed condensate from said heat exchanger through said body void space.

2. A method for enhanced heat transfer according to claim 1 wherein said first fluid is contacted with and at least partially condensed by the metal body single layer with a heat transfer coefficient ratio to a smooth surface h/hu of at least 3.

3. A method for enhanced heat transfer according to claim 1 wherein a multiple layer of stacked metal particles is integrally bonded together and to said opposite side of said metal substrate to form interconnected pores having an equivalent pore radius less than 4.5 mils and said second colder fluid is boiled in contact with said multiple layer.