RF Shield for an electronic component

• US 4,218,578 A
• Filed: 08/04/1978
• Issued: 08/19/1980
• Est. Priority Date: 08/04/1978
• Status: Expired due to Term

• Current Assignee: Burr-Brown Research Corporation
• Original Assignee: Burr-Brown Research Corporation
• Inventors: Stitt, Robert M., Olschewski, Wilfred W.
• Primary Examiner(s): Goldberg, Elliot A.
• Assistant Examiner(s): Tone, D. A.
• Application Number:
  US05/931,145
• Time in Patent Office: 746 Days
• Field of Search: 174/35 R, 174/35 GC, 174/35 MS, 174/51, 361/424, 325/357, 330/68, 331/67, 334/85, 336/84 C
• US Class Current: 174/372
• CPC Class Codes: H05K 9/002 with localised screening
• CPC Class Codes: Y10S 174/35 Box or housing mounted on substrate or PCB

Abstract

This disclosure relates to a housing or enclosure for an electronic component such as a hybrid module to provide RF shielding therefor. The RF shield has a gap separating two parts of the housing or enclosure to provide D.C. isolation between input and output electrical grounds. In one embodiment, the gap is attained by positioning a split metal sheet or layer within dielectric material such as an inner and outer layer of plastic material. Thus, the gap between the split portions of the RF shield is fixed, set or positioned during the formation of the sandwich dielectric-metal-dielectric structure. The gap has a very narrow spacing to obtain optimum RF shielding while still providing D. C. isolation. The dielectric material in the gap between the two split metal portions of the RF shield prevents electrical arcing between the split portions. In another embodiment, a dielectric, gap forming and metal holding (and separating) member is used to separate the two metal portions of the RF shield.

Claims

1. An RF shield for an electronic device comprising, in combination, a base support member having first and second conductive sheets secured in spaced relationship to each other by encapsulation in dielectric material thereby defining a gap therebetween, a cover having first and second metal portions secured in spaced relationship to each other by encapsulation in dielectric material thereby defining a gap therebetween, and means for connecting said sheets and said metal portions together to define a D.C. isolated RF shield enclosure for said electronic device.

2. An RF shield as recited in claim 1 further including a separate electrical ground connector coupled to each of said first and second metal portions of said cover.

3. An RF shield for an electronic device comprising, in combination, a base support member having first and second conductive sheets secured in spaced relationship to each other by dielectric material thereby defining a gap therebetween, said base support member being provided with a plurality of apertures through which means for electrically connecting the electronic device may extend, a cover having first and second metal portions secured in spaced relationship to each other by dielectric material thereby defining a gap therebetween, and means for connecting said sheets and said metal portions together to define a D.C. isolated RF shield enclosure for said electronic device, the dielectric material of said base support member encapsulating said first and second conductive sheets having notches therein exposing portions of the sheets, and said cover having metal tabs outwardly extending from said metal portions of said cover which are clinched to said sheets of said base support member.

4. A RF shield as recited in claim 3 wherein said metal tabs provide electrical and mechanical connection between said base support member and said cover.

5. A RF shield as recited in claim 3 wherein said sheets and said portions are of an electrically conductive ferromagnetic material.

6. A RF shield as recited in claim 3 wherein said gaps are in the range of from about 0.01 to about 0.15 inches.

7. A RF shield as recited in claim 6 wherein said gaps provide D.C. isolation between input and output grounds for the electronic device.

8. A RF shield as recited in claim 3 wherein the dielectric material overlaps substantially all surfaces of said sheets and said metal portions.

9. A RF shield as recited in claim 3 wherein the dielectric material overlays the sheets and metal portions only adjacent to the gaps.