Compact circuit package having improved circuit connectors

• US 4,218,724 A
• Filed: 11/21/1978
• Issued: 08/19/1980
• Est. Priority Date: 11/21/1978
• Status: Expired due to Term

• Current Assignee: Teledyne Technologies Incorporated
• Original Assignee: Lance R. Kaufman
• Inventors: Kaufman, Lance R.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US05/962,588
• Time in Patent Office: 637 Days
• Field of Search: 339/17 M, 339/17 N, 361/380, 361/386, 361/426, 361/395, 361/392, 361/399, 361/412, 361/415
• US Class Current: 361/736
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00

Abstract

A circuit package has an inverted receptacle-like housing with a base plate and a depending peripheral wall. Upper and lower substrates are spaced within the housing with the major elements including lead frame elements and thick film conductor circuits on the facing surfaces. The upper substrate, typically containing control circuitry, is mounted along the under side of the base plate while the lower substrate, typically containing power circuitry, closes the receptacle and forms a heat sink for the circuit package. Lead frame extensions within power input and output circuitry project from the lower substrate and protrude through openings within the upper surface of the base plate. In addition, lead frame extensions within the control circuitry on the first substrate likewise protrude through the base plate openings. In certain instances, lead frame extensions from both of the substrates are commonly located in the same opening and operatively provide electrical coupling between the two substrates. In certain instances, terminal plugs are removeably connected to one or more lead frame extensions located within said base plate openings for external electrical connections.

Claims

1. A circuit package comprising:

a housing having a base plate surrounded by a peripheral wall to form a circuit receiving receptacle;

a first substrate positioned in said receptacle with one side adjacent the interior side of said base plate and the other side containing electrical circuitry, said substrate having a first set of electrical leads comprising sheet-like lead frame extensions extending from said substrate;

a second substrate positioned in said receptacle adjacent the rim of said peripheral wall and closing the receptacle of said housing, said second substrate being spaced from said first substrate in said housing and having circuitry on the side facing said first substrate, said second substrate having a second set of leads comprising sheet-like lead frame extensions extending from said substrate; and

a plurality of recessed cells in said base plate extending through said base plate and opening on the exterior side thereof, selected leads of said first and second sets positioned within and surrounded by selected ones of said recessed cells to engage external connector means inserted in said cells for interconnection within external electrical circuits.

2. The circuit package according to claim 1 wherein other selected leads of said first and second sets are commonly positioned within selected ones of said recessed cells, said commonly located leads being electrically coupled for interconnecting the circuitries of said first and second substrates together and engageable with external connector means.

3. The circuit package according to claim 2 wherein the leads of said first and second sets comprise sheet-like lead frame extensions and wherein the thickness of the commonly connected lead frame extensions is reduced.

4. The circuit package according to claim 1 wherein at least one of said first and second substrates has power circuitry input and output terminals mounted thereon and protruding through said housing for permitting external power circuit connection to said circuit package.

5. The circuit package according to claim 4 wherein the circuitry on said second substrate comprises a power circuit and wherein said input and output terminals are mounted on said second substrate and protrude through the exterior side of said base plate.

6. The circuit package according to claim 5 wherein said input and output terminals comprise cylindrical stud-like terminals.

7. The circuit package according to claim 1 wherein the electrical circuitry on said first substrate has adjustable elements controlling the operation thereof and wherein said adjustable elements are mounted on the side of said first substrate adjacent said base plate and extend through said base plate to the exterior side thereof.

8. The circuit package according to claim 5 wherein the electrical circuitry on said first substrate has adjustable elements controlling the operation thereof and wherein said adjustable elements are mounted on the side of said substrate adjacent said base plate and extend through said base plate to the exterior side thereof.

9. The circuit package according to claim 1 wherein said second substrate closing the receptacle of said housing forms a heat sink for dissipating heat from said circuitries.

10. The circuit package according to claim 1 wherein the circuit of said package includes control circuitry and power circuitry and wherein said control circuitry is mounted on said first substrate and said power circuitry is mounted on said second substrate.

11. A package for a circuit including control circuitry and power circuitry, said package comprising:

a housing including a base plate surrounded by a peripheral wall to form a circuit receiving receptacle;

a first substrate positioned in said receptacle with one side adjacent the interior side of said base plate and the other side containing the control circuitry, said substrate having a first set of electrical leads extending from said substrate;

a second substrate positioned in said receptacle adjacent a rim of said peripheral wall and closing the receptacle of said housing, said second substrate being spaced from said first substrate in said housing and having the power circuitry on a first side facing said first substrate and a heat transmitting second side oppositely disposed from said first side for dissipating heat from said circuitries, said second substrate having a second set of leads extending from said substrate, said power circuitry having power input and output terminals mounted thereon and protruding through the exterior side of said base plate; and

12. a plurality of recessed cells in said base plate extending through said base plate and opening on the exterior side thereof, selected leads of said first and second sets positioned within and surrounded by selected ones of said recessed cells to engage external connector means inserted in said cells for interconnection within external electrical circuits, other selected leads of said first and second sets being commonly positioned within selected ones of said recessed cells, said commonly located leads being electrically coupled for interconnecting the circuitries of said first and second substrates together and engageable with external connector means inserted in said cells.