Liquid seeders for electroless metal deposition
First Claim
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1. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:
- (a) a source of cuprous ions;
(b) a source of hydrogen ions;
(c) a source of halogen ions;
(d) at least one organic solvent for said source of cuprous ions, said solvent being present in at least an amount sufficient to solubilize said source of cuprous ions; and
(e) a reducing agent capable of reducing cupric ions to cuprous ions, but incapable of reducing cuprous ions to elemental copper in the environment of said admixture.
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Abstract
Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.
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Citations
14 Claims
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1. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:
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(a) a source of cuprous ions; (b) a source of hydrogen ions; (c) a source of halogen ions; (d) at least one organic solvent for said source of cuprous ions, said solvent being present in at least an amount sufficient to solubilize said source of cuprous ions; and (e) a reducing agent capable of reducing cupric ions to cuprous ions, but incapable of reducing cuprous ions to elemental copper in the environment of said admixture. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:
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(a) cuprous chloride; (b) hydrochloric acid; (c) at least one member of the group consisting of lower chain alkyl glycols and glycol ethers and dimethyl formamide, said material being present in an amount at least sufficient to solubilize said cuprous chloride; and (d) at least one member of the group consisting of sodium hypophosphite and stannous chloride.
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Specification