Liquid seeders for electroless metal deposition

• US 4,222,778 A
• Filed: 03/30/1979
• Issued: 09/16/1980
• Est. Priority Date: 03/30/1979
• Status: Expired due to Term

• Current Assignee: Amp-Akzo Corporation
• Original Assignee: Kollmorgen Technologies Corporation
• Inventors: Nuzzi, Francis J., Vitellaro, Daniel F.
• Primary Examiner(s): Kendall, Ralph S.
• Application Number:
  US06/025,546
• Time in Patent Office: 536 Days
• Field of Search: 106/1.11, 427/304, 427/305, 427/306
• US Class Current: 106/1.11
• CPC Class Codes: C23C 18/28 Sensitising or activating

Abstract

Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.

Claims

1. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:

(a) a source of cuprous ions;

(b) a source of hydrogen ions;

(c) a source of halogen ions;

(d) at least one organic solvent for said source of cuprous ions, said solvent being present in at least an amount sufficient to solubilize said source of cuprous ions; and

(e) a reducing agent capable of reducing cupric ions to cuprous ions, but incapable of reducing cuprous ions to elemental copper in the environment of said admixture.

2. A liquid seeder according to claim 1, wherein said halogen includes chlorine.

3. A liquid seeder according to claim 1, wherein component (a) is cuprous chloride.

4. A liquid seeder according to claim 1, wherein component (b) is hydrochloric acid.

5. A liquid seeder according to claim 1, wherein component (c) comprises cuprous chloride and hydrochloric acid.

6. A liquid seeder according to claim 1, wherein component (c) comprises only halogen-containing salts.

7. A liquid seeder according to claim 6, wherein component (c) comprises at least one member of the group consisting of the halogen salts of strontium and calcium.

8. A liquid seeder according to claim 7, wherein component (c) comprises at least one member of the group consisting of strontium chloride and calcium chloride.

9. A liquid seeder according to claim 8, wherein component (b) comprises only non-halogen acids.

10. A liquid seeder according to claim 1, wherein component (b) comprises only non-halogen acids.

11. A liquid seeder according to claim 10, wherein component (b) comprises at least one member of the group consisting of nitric acid and tartaric acid.

12. A liquid seeder according to claim 1, wherein component (d) comprises at least one member of the group consisting of lower chain alkyl glycols and glycol ethers and dimethyl formamide.

13. A liquid seeder acording to claim 1, wherein component (e) comprises at least one member of the group consisting of sodium hyphphosphite and stannous chloride.

14. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:

(a) cuprous chloride;

(b) hydrochloric acid;

(c) at least one member of the group consisting of lower chain alkyl glycols and glycol ethers and dimethyl formamide, said material being present in an amount at least sufficient to solubilize said cuprous chloride; and

(d) at least one member of the group consisting of sodium hypophosphite and stannous chloride.