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Liquid seeders for electroless metal deposition

  • US 4,222,778 A
  • Filed: 03/30/1979
  • Issued: 09/16/1980
  • Est. Priority Date: 03/30/1979
  • Status: Expired due to Term
First Claim
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1. A liquid seeder for the catalyzation of a substrate to the electroless deposition of metal, said liquid seeder comprising the admixture of:

  • (a) a source of cuprous ions;

    (b) a source of hydrogen ions;

    (c) a source of halogen ions;

    (d) at least one organic solvent for said source of cuprous ions, said solvent being present in at least an amount sufficient to solubilize said source of cuprous ions; and

    (e) a reducing agent capable of reducing cupric ions to cuprous ions, but incapable of reducing cuprous ions to elemental copper in the environment of said admixture.

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