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Process for embossing a relief pattern into a thermoplastic information carrier

  • US 4,223,050 A
  • Filed: 10/03/1978
  • Issued: 09/16/1980
  • Est. Priority Date: 05/04/1976
  • Status: Expired due to Term
First Claim
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1. A method for embossing a selected high-resolution diffraction phase relief pattern representing coded information into a thermoplastic information carrier, comprising:

  • placing the thermoplastic information carrier on a support member;

    pressing a foil-shaped embossing matrix onto the thermoplastic information carrier, said embossing matrix having a diffraction phase relief pattern on the surface which is pressed onto the thermoplastic information carrier, and comprising a plurality of band-shaped branches each having a portion of said relief pattern contained thereon;

    selectively heating the embossing matrix by passing an electric current impulse through selected said branches of said matrix while it is pressed onto the thermoplastic information carrier, to cause the portions of the relief pattern contained on said branches to be embossed into the thermoplastic information carrier; and

    maintaining the embossing matrix pressed onto the thermoplastic information carrier after the electric current impulse has ceased, until the selected embossed relief pattern formed on the thermoplastic information carrier has hardened.

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