Mounting assembly for semiconductive controlled rectifiers
First Claim
1. A mounting assembly for a press-pack semiconductive controlled rectifier comprising base block means formed from material of high heat conductivity, a depressed portion formed in a surface of said base block means, a first electrical bus bar at the bottom of said depressed portion, a press-pack semiconductive controlled rectifier positioned on said first bus bar with one terminal in electrical contact with said first bus bar, a second bus bar extending across said surface of the base block and in electrical contact with the other terminal of the semiconductive controlled rectifier, and insulating material between said bus bars and said base block means, said insulating material permitting heat to flow from both bus bars into the base block means which acts as a common heat sink to dissipate heat from both bus bars.
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Abstract
A mounting assembly for press-pack semiconductive controlled rectifiers wherein the rectifiers are all thermally connected to the same heat sink using an insulating medium, the rectifiers being electrically interconnected using common bus bars as required to provide a desired alternating current or direct current connection. A common spring arrangement is used to apply appropriate pressure to at least two semiconductors at once to hold them in contact with their associated bus bars. At least one of the interconnecting bus bars for the rectifiers is formed of a malleable conducting medium, such as copper, formed and used in a manner to provide load equalizing and surface alignment such that the spring can transmit uniform pressure to the heat sink and the semiconductive controlled rectifiers.
59 Citations
13 Claims
- 1. A mounting assembly for a press-pack semiconductive controlled rectifier comprising base block means formed from material of high heat conductivity, a depressed portion formed in a surface of said base block means, a first electrical bus bar at the bottom of said depressed portion, a press-pack semiconductive controlled rectifier positioned on said first bus bar with one terminal in electrical contact with said first bus bar, a second bus bar extending across said surface of the base block and in electrical contact with the other terminal of the semiconductive controlled rectifier, and insulating material between said bus bars and said base block means, said insulating material permitting heat to flow from both bus bars into the base block means which acts as a common heat sink to dissipate heat from both bus bars.
- 3. A mounting assembly for press-pack semiconductive controlled rectifiers comprising a base block formed from material of high heat conductivity, at least two depressed portions formed in the surface of said base block, first and second generally parallel electrical bus bars at the bottoms of said depressed portions, press pack semiconductive controlled rectifiers positioned on said first and second bus bars each with one terminal in electrical contact with an associated one of said first and second bus bars, a third bus bar extending across said surface of the base block transversely of said first and second bus bars and in electrical contact with the other terminals of each of the semiconductive controlled rectifiers, said first and second bus bars being electrically insulated from the bottoms of said depressed portions and said third bus bar being electrically insulated from said surface of the base block in which said depressions are formed by thin-film insulating material which will permit heat to flow from the bus bars into the base block, and means for exerting force on said third bus bar to hold the semiconductive controlled rectifiers in compression between the third bus bar and a respective one of said first and second bus bars.
Specification