System for regulating the applied blade-to-boule force during the slicing of wafers

• US 4,228,782 A
• Filed: 09/08/1978
• Issued: 10/21/1980
• Est. Priority Date: 09/08/1978
• Status: Expired due to Term

• Current Assignee: RCA Corporation
• Original Assignee: RCA Corporation
• Inventors: Demers, Robert R., Leedom, Marvin A.
• Primary Examiner(s): Whitehead, Harold D.
• Application Number:
  US05/940,751
• Time in Patent Office: 774 Days
• Field of Search: 51/165 B, 51/165.77, 51/165.8, 51/165.92, 51/73 R, 51/135, 125/13, 125/16 R, 125/14
• US Class Current: 125/14
• CPC Class Codes: B23D 59/001 Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade measuring in general G01; controlling in general G05
• CPC Class Codes: B28D 5/0082 for supporting, holding, feeding, conveying or discharging work
• CPC Class Codes: B28D 5/022 by cutting with discs or wheels

Abstract

A system for controlling the blade-to-boule feedrate of a wafer cutting saw to regulate the blade-to-boule force in accordance with predetermined criteria and for monitoring the cutting efficiency of the blade and determining when the blade needs to be dressed to increase its cutting efficiency. A constant blade-to-boule force is preferred.

Claims

1. In a wafer saw for slicing thin wafers from a boule of source material in which said saw has a saw blade which revolves at high speed for slicing wafers from said boule;

said saw holds said boule stationary during the slicing of each wafer;

said saw translates said revolving saw blade to cause the cutting surface of said blade to penetrate said stationary boule to slice a wafer from said boule by removing boule material which attaches said wafer to the remainder of said boule and said boule and said saw has a control system for controlling the rate of translation of said blade, the improvement comprising;

means for regulating the blade-to-boule force urging said blade of said saw into said boule during the slicing of wafers to improve the as-sawn quality of the wafers, said means for regulating comprising;

force sensing means for sensing the blade-to-boule force urging said blade of said saw into said boule;

said force sensing means comprising a transducer fixed to said stationary boule for sensing said blade-to-boule force;

force reference means for establishing a desired pattern of blade-to-boule force;

force comparator means for determining whether said sensed blade-to-boule force exceeds said desired blade-to-boule force and for determining whether such sensed blade-to-boule force is less than said desired blade-to-boule force by more than a desired force-hysteresis amount;

control means for decreasing the feedrate of said saw blade into said boule when said force comparator means produces an output indicating that said sensed blade-to-boule force is greater than said desired blade-to-boule force and for increasing said feedrate when said comparator means produces an output indicating that said sensed blade-to-boule force is less than said desired blade-to-boule force by an amount which is greater than said desired force hysteresis amount.

2. The improvement recited in claim 1 wherein the maximum desired blade-to-boule force is less than 4 pounds.

3. The improvement recited in claim 1 wherein said saw blade is a thin annular disk with the cutting edge on the inner periphery thereof.

4. The improvement recited in claim 1 wherein said force reference means is adapted to establish a constant desired force.

5. The improvement recited in claim 1 wherein said desired pattern of blade-to-boule force is a function of at least one variable selected from the group consisting of the saw blade position, feedrate of said saw blade, and the desired quality of as-sawn wafers.

6. The improvement recited in claim 5 wherein said force reference means is adapted to establish a desired force which is a function of the saw blade position.

7. The improvement recited in claim 1 further comprising:

feedrate sensor means for sensing the feedrate of said saw; and

position determining means for determining the position of said saw blade and wherein said force reference establishes a desired force which is a function of at least one of the variables selected from the group consisting of;

saw position, feedrate of said saw, saw-to-boule force and the desired quality of the as sawn wafers.

8. The improvement recited in claim 1 further comprising:

feedrate sensor means for sensing the feedrate of said saw;

feedrate reference means for establishing a maximum desired feedrate;

feedrate comparator means for determining whether said sensed feedrate is greater than said maximum desired feedrate and for determining whether said feedrate is less than said maximum desired feedrate by an amount which is greater than a desired feedrate-hysteresis amount; and

wherein;

said control means decreases said feedrate when said feedrate comparator produces an output indicating that said sensed feedrate is greater than said maximum desired feedrate, even if so doing decreases said blade-to-boule force to less than said desired blade-to-boule force minus said desired force-hysteresis amount; and

said control means does not increase said blade-to-boule feedrate when said feedrate is between said maximum desired feedrate minus said desired feedrate-hysteresis amount and said maximum desired feedrate, even though said force comparator output indicates that said sensed blade-to-boule force is less than said desired blade-to-boule force by an amount which is greater than said desired force-hysteresis amount.

9. The improvement recited in claim 1 further comprising:

means for determining the cutting efficiency of said saw.

10. The improvement recited in claim 9 wherein said means for determining the cutting efficiency of said saw comprises:

timer means for measuring the length of time required to slice a wafer from said boule.

11. The improvement recited in claim 10 further comprising:

display means for displaying the time required to slice a selected wafer.

12. The improvement recited in claim 10 wherein said means for determining further comprises:

time reference means for establishing a desired maximum time-to-slice-a-wafer; and

time comparator means for determining when said measured time-to-slice-a-wafer is greater than said desired maximum time-to-slice-a-wafer.

13. The improvement recited in claim 8 further comprising:

means for determining the cutting efficiency of said saw, said means for determining the cutting efficiency comprising;

position sensing means for determining the position of said saw blade; and

logic means for determining the cutting efficiency of said saw from the measured position of said saw, the measured blade-to-boule force and the measured feedrate of the saw, said logic means producing an output which is a measure of the cutting efficiency of said saw.

14. The improvement recited in claim 10 or 13 further comprising:

alarm means response to said cutting efficiency determining means for signaling when said cutting efficiency determining means produces an output indicating that said measured cutting efficiency fails to meet a standard for minimum cutting efficiency.

15. The improvement recited in claim 14 wherein:

said alarm means prevents said saw from automatically slicing another wafer from said boule until after at least the prevention aspect of said alarm has been reset.

16. The improvement recited in claim 1 wherein the maximum desired blade-to-boule force is less than 3 pounds.