Bonding electronic component to molded package

• US 4,230,754 A
• Filed: 11/07/1978
• Issued: 10/28/1980
• Est. Priority Date: 11/07/1978
• Status: Expired due to Term

• Current Assignee: Sprague Electric Company
• Original Assignee: Sprague Electric Company
• Inventors: Maher, John P., Kam-Lum, Elsa
• Primary Examiner(s): Robinson, Ellis P.
• Application Number:
  US05/958,598
• Time in Patent Office: 721 Days
• Field of Search: 428/391, 428/387, 428/417, 428/447, 428/450, 428/413, 428/76, 264/272, 264/135, 174/52 PE, 357/72, 427/118, 427/96, 427/58
• US Class Current: 428/76
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/705 of thick-film circuits or parts thereof
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/3171 the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/2962 Silane, silicone or siloxane in coating
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31525 Next to glass or quartz
• CPC Class Codes: Y10T 428/31663 As siloxane, silicone or silane

Abstract

An electronic component with leads attached is cleaned, a layer of an epoxy or epoxy-reactive silane is applied and cured, and then the package material is molded on. The silane layer bonds the component to the package and provides a fluid-tight seal therebetween. The silane is gamma-glycidoxypropyl- or gamma-aminopropyltrimethoxy or triethoxy silane.

Claims

1. In the manufacture of a fully-molded electronic component having leads attached thereto, the steps of:

applying a thin seal layer of an epoxy-reactive silane directly onto said component including that portion of said attached leads adjacent said component, then curing said layer to co-react said silane with said component and leads and form said seal, then subjecting said component with attached leads and said seal to a transfer molding operation to surround said component and said portion of attached leads in an epoxy package, said silane being chosen from the group consisting of gamma-aminopropyl trimethoxy silane, gamma-aminopropyl triethoxy silane, gamma-glycidoxypropyl trimethoxy silane, and gamma-glycidoxypropyl triethoxy silane and bonding said sealed component and leads to said epoxy package by reaction during said transfer molding operation.

2. A molded electronic component comprising an electronic network on a substrate with lead wires forming a unit, a sealing layer of epoxy silane or epoxy-reactive silane surrounding said unit and bonded thereto, and a molded epoxy package surrounding said unit and layer and bonded to said unit via said layer wherein said layer is cured prior to molding said epoxy package.