Housing for semiconductor device

• US 4,230,901 A
• Filed: 05/01/1979
• Issued: 10/28/1980
• Est. Priority Date: 05/03/1978
• Status: Expired due to Term

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Vogt, Herbert, Wengler, Christian
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US06/035,271
• Time in Patent Office: 546 Days
• Field of Search: 29/588, 29/627, 174/16 HS, 174/52 PE, 174/52 S, 357/80, 357/81, 361/381, 361/386-389
• US Class Current: 174/564
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semiconductor device and has a mounting surface connectible to a heat sink and a lateral surface perpendicular to the mounting surface. Contacts extend from inside the housing cup through the bottom and are firmly connected thereto. Cutouts are formed in the metal plate at the edges thereof opposite said contacts. The mounting surface of the metal plate extends beyond the wall opposite the bottom. The housing is fillable with sealing compound through the cutouts to an extent where at least part of the lateral surface of the metal plate is wetted with sealing compound.

Claims

1. Housing for a semiconductor device, comprising a housing cup in which the semiconductor device is disposed, said housing cup having a bottom, a wall and a metal plate disposed opposite said bottom, said metal plate being thermally connected to the semiconductor device and having a mounting surface connectible to a heat sink and a lateral surface perpendicular to said mounting surface, contacts extending from inside said housing cup through said bottom and being firmly connected thereto, and cutouts formed in said metal plate at the edges thereof opposite said contacts, said mounting surface of said metal plate extending beyond said wall opposite said bottom, said housing being filled with sealing compound through said cutouts to an extent where at least part of said lateral surface of said metal plate is wetted with sealing compound.

2. Housing according to claim 1, including projections integral with the inside of said wall, said metal plate being supported on said projections.

3. Housing according to claim 1, wherein said metal plate is so dimensioned that only the lateral surface thereof at said cutouts are wetted with sealing compound.

4. Housing according to claim 1, wherein said contacts are pressed-in to said bottom.

5. Housing according to claim 1, 2, 3 or 4, wherein said metal plate is smaller than the inside dimension of said wall so as to leave a space between said lateral edges and the inside of said wall.