High temperature-resistant conductive adhesive and method employing same

• US 4,233,103 A
• Filed: 12/20/1978
• Issued: 11/11/1980
• Est. Priority Date: 12/20/1978
• Status: Expired due to Term

• Current Assignee: United States Of America As Represented By The Secretary Of The Air Force
• Original Assignee: United States Of America As Represented By The Secretary Of The Air Force
• Inventors: Shaheen, Joseph M.
• Primary Examiner(s): Gallagher, John J.
• Application Number:
  US05/971,580
• Time in Patent Office: 692 Days
• Field of Search: 156/299-331, 428/328-473.5, 260/37 M, 528/335, 29/589, 252/511-514, 75/135 T
• US Class Current: 156/331.8
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09J 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 156/1092 : All laminae planar and face to face
• CPC Class Codes: Y10T 428/12069 : Plural nonparticulate metal components
• CPC Class Codes: Y10T 428/256 : Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/31721 : Of polyimide

Abstract

A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.

Claims

1. A method for bonding a semiconductor die to a substrate which comprises applying to the substrate a film of an adhesive formulation comprising an alloy of gallium-tin eutectic and gold dispersed in a solution of a polyimide resin;

positioning a semiconductor die in contact with the film;

pressing the die firmly in place; and

curing the adhesive formulation to a solid bond material.

2. The method according to claim 1 in which the adhesive formulation comprises (1) an alloy containing about 20 to 80 weight percent of gallium-tin alloy and 80 to 20 percent gold, based on a total of 100 weight percent, and (2) about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy.

3. A high temperature-resistant, conductive adhesive composition comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.

4. The compositionn according to claim 3 which comprises (1) an alloy containing about 20 to 80 weight percent of gallium-tin eutectic and 80 to 20 weight percent gold, based on a total of 100 weight percent, and (2) about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy.

5. The composition according to claimm 4 which comprises 48.5 weight percent eutectic, 48.5 weight percent gold and 3 weight percent polyimide resin.