Process for producing an electrostatically deformable thin silicon membranes utilizing a two-stage diffusion step to form an etchant resistant layer

• US 4,234,361 A
• Filed: 07/05/1979
• Issued: 11/18/1980
• Est. Priority Date: 07/05/1979
• Status: Expired due to Term

• Current Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Original Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Inventors: Guckel, Henry, Larsen, Steven T.
• Primary Examiner(s): Dean, R.
• Assistant Examiner(s): Saba, W. G.
• Application Number:
  US06/054,815
• Time in Patent Office: 502 Days
• Field of Search: 148/175, 148/186-188, 148/189, 29/580,610 SG, 156/628, 156/647, 156/648, 156/649, 156/657, 156/662, 357/26, 357/60, 357/55, 137/827, 137/831, 73/777, 338/2, 338/4
• US Class Current: 438/566
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/2252 using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
• CPC Class Codes: H01L 21/30608 Anisotropic liquid etching H01L21/3063 takes precedence
• CPC Class Codes: Y10S 438/924 To facilitate selective etching
• CPC Class Codes: Y10S 438/974 Substrate surface preparation
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

The invention relates to thin silicon membranes formed in layers of silicon such as are normally utilized as substrates in the manufacture of integrated electronic circuits. The thin membranes constructed in accordance with the invention are capable of deformation by electrostatic forces and are applicable to a wide range of uses including the manufacture of solid state pressure sensors, resonant, and antenna structures, as well as electro-optical display elements. A processing technique is disclosed which is particularly adapted to forming membranes in silicon substrates in a manner which is compatible with the construction thereon of other integrated circuit components. The process involves a short and concentrated deposition diffusion of boron into one of the surfaces of the substrate, followed by rapid and substantially oxygen and water vapor free transfer of the substrate to a drive furnace which is oxygen and water vapor free in which diffusion to a preselected depth takes place over a controlled period of time.

Claims

1. A process for producing mechanically stable thin membranes in a crystalline silicon substrate suitable for incorporation in integrated circuits, comprising the steps of:

(a) diffusing boron into one of the opposite sides of a silicon substrate in a deposition furnace for a period of time not greater than approximately 90 minutes, with the boron being supplied in an amount sufficient and at a temperature sufficient to form a layer in the silicon substrate having boron atom concentrations greater than 10²¹ per cubic centimeter;

(b) transferring the diffused silicon substrate from the deposition furnace to a drive furnace while substantially excluding absorption of water vapor by the silicon substrate;

(c) heating the substrate in the drive furnace in an ambient gas which is substantially oxygen and water vapor free for a selected period of time at a temperature sufficient to drive the diffused boron to a desired depth in the silicon substrate;

(d) masking the side of the substrate opposite to the boron diffused layer to expose a selected area of silicon at a portion of the surface having selected lateral dimensions; and

(e) applying a silicon etchant to the exposed unmasked surface area until sufficient silicon is dissolved to expose the diffused boron layer and be retarded from further etching thereby, the exposed portion of the etchant resistant layer thereby forming a thin membrane.

2. The process of claim 1 wherein the silicon substrate is selected such that the parallel faces of the substrate are oriented in (100) crystal directions.

3. The process of claim 1 including before the step of diffusing boron in the deposition furnace, the steps comprising:

cleaning the silicon substrate with an organic solvent selected from the group consisting of xylene, acetone, and trichloroethylene, and mixtures thereof;

the clean substrate then being treated with an inorganic cleaning agent selected from the group consisting of sulfuric acid, hydrofluoric acid, and a mixture of hydrogen peroxide and ammonium hydroxide;

the treated substrates then being oxidized in an ambient gas comprising a mixture of oxygen and water to form an oxide layer on both surfaces of the substrate;

masking portions of the surfaces of the oxide coated substrate to leave open desired areas in which the oxide is to be removed;

applying an oxide etchant to the masked surface to remove the oxide layer leaving an exposed portion of the substrate into which boron can be diffused.

4. The process of claim 1 wherein the etchants used to etch the silicon are selected from the group consisting of hydrazine, potassium hydroxide, and a mixture of ethylene diamine, water, and pyrocatechol.

5. The process of claim 1 wherein the step of diffusing boron into one of the sides of the silicon substrate is achieved by placing the substrate in an atmosphere comprising B₂ H₆, oxygen, and nitrogen.

6. The process of claim 5 wherein the deposition diffusion atmosphere gases are supplied at flow rates of approximately 420 cubic centimeters per minute of B₂ H₆ at 5,000 parts per million in argon, 75 cubic centimeters per minute of O₂, and 9,000 cubic centimeters per minute of N₂.

7. The process of claim 1 wherein the step of transferring the diffused silicon substrate from the deposition furnace to the drive furnace is accomplished in an atmosphere consisting essentially of nitrogen with less than 5 parts per million each of water and oxygen.

8. The process of claim 1 wherein the ambient atmosphere of the drive furnace consists essentially of nitrogen with less than 5 parts per million of oxygen and less than 5 parts per million of water vapor.

9. The process of claim 1 wherein the step of diffusing boron into the substrate is performed for a period of time in the range of 20 minutes to 90 minutes at an ambient temperature in the range of 850°

C. to 1250°

C.

10. The process of claim 1 wherein the step of heating the substrate in a drive furnace is performed for a period of time in the range of 0.1 hour to 4 hours at an ambient temperature in the range of 950°

C. to 1250°

C.