Thermoplastic resin-coated metallic substrate and the method of producing the same

• US 4,237,186 A
• Filed: 07/28/1978
• Issued: 12/02/1980
• Est. Priority Date: 07/28/1978
• Status: Expired due to Term

• Current Assignee: National Wire Products
• Original Assignee: Colorguard Corporation
• Inventors: Ingraham, Glen E.
• Primary Examiner(s): Bell, James J.
• Application Number:
  US05/928,911
• Time in Patent Office: 858 Days
• Field of Search: 428/364, 428/375, 428/379, 428/380, 428/383, 428/398, 428/457, 428/458, 427/409, 427/435, 427/117, 427/118, 264/129, 264/174, 264/178 R, 264/237
• US Class Current: 428/379
• CPC Class Codes: B05D 1/18 performed by dipping
• CPC Class Codes: B05D 2350/65 metal layer
• CPC Class Codes: B05D 7/20 to wires for insulating electric cables H01B13/16
• CPC Class Codes: B05D 7/54 No clear coat specified
• CPC Class Codes: Y10T 428/2933 Coated or with bond, impregnation or core
• CPC Class Codes: Y10T 428/294 including metal or compound thereof [excluding glass, ceramic and asbestos]
• CPC Class Codes: Y10T 428/2942 Plural coatings
• CPC Class Codes: Y10T 428/2947 Synthetic resin or polymer in plural coatings, each of different type
• CPC Class Codes: Y10T 428/2975 Tubular or cellular
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A metallic substrate and a thermoplastic resinous coating are bonded to one another by a resinous hot melt adhesive. The method of applying the coating to effect the bond includes applying to the metallic substrate a resinous hot melt polyamide adhesive composition which has been found to adhere firmly to the metallic substrate and to form a secure bond with the molten thermoplastic resin extruded onto said hot melt adhesive at high rates of speed.

Claims

1. A protectively coated wire comprising a metallic wire substrate and bonded to said substrate a polyamide resin hot melt adhesive, said polyamide hot melt adhesive comprising the condensation product of alkylene diamines of the formula:

space="preserve" listing-type="equation">H.sub.2 N(CH.sub.2).sub.x NH.sub.2,

wherein x is an integer of from 2 to 20; and

polymeric fat acids having a dimeric fat acid content greater than about 90 percent by weight;

the molar equivalent of amine employed being about equal to the molar equivalent of carboxyl groups present in said fat acid;

said condensation product having a softening point of 112°

C. to 138°

C. and a tensile strength of from 400 pounds per square foot to 600 pounds per square foot; and

a second ply in a thickness of at least 0.015 inch of an extrudable thermoplastic resin adhering to said substrate by means of said adhesive.

2. A protectively coated wire as claimed in claim 1, wherein said extrudable thermoplastic resin is a plasticized vinyl resin.

3. A protectively coated wire as claimed in claim 1, wherein said plasticized vinyl resin is present in a thickness of at least 0.015 inch to 0.025 inch.

4. A protectively coated wire as claimed in claim 2, wherein said vinyl resin is a plasticized polyvinyl chloride comprising 100 parts by weight of vinyl chloride homopolymer and from 25 parts to 40 parts of a plasticizer per hundred parts of homopolymer.

5. A protectively coated wire as claimed in claim 4, wherein said plasticizer is non-migratory with respect to said hot melt adhesive.

6. A protectively coated wire as claimed in claim 2, wherein said vinyl resin is plasticized vinyl chloride homopolymer.

7. A protectively coated wire in accordance with claim 2, wherein said vinyl resin is a copolymer of not less than seventy percent by weight of polymerized vinyl chloride and not more than thirty percent by weight of a vinyl ester of the general formula:

##STR2## wherein R is a lower alkyl radical.

8. A protectively coated wire as claimed in claim 1, wherein the diamines of said polyamide resin hot melt adhesive coming within the formula therein recited include those in which x is an integer of from 2 to 6 and said polyamide resin has a melt viscosity of 10 to 100 poises at 210°

C.; and

a percentage elongation of from 400 to 600.

9. A protectively coated wire as claimed in claim 8, wherein said polyamide has a Brookfield melt viscosity of 40 to 60 poises at 210°

C.

10. A protectively coated wire as claimed in claim 1, wherein said substrate is galvanized steel wire;

said polyamide adhesive has a softening point of from about 135°

C. to 138°

C.;

a Brookfield melt viscosity of about 45 at 210°

C.;

a tensile strength of about 500 pounds per square inch; and

a percent elongation of about 550.

11. A protectively coated metallic wire substrate as claimed in claim 10, wherein said substrate is galvanized steel wire including a lightly oxidized slab zinc surface coating.

12. A protectively coated wire as claimed in claim 1, wherein said substrate is galvanized steel wire.

13. A protectively coated wire as claimed in claim 1, wherein said substrate is aluminum-coated steel.

14. A protectively coated wire as claimed in claim 1, wherein said substrate is bethanized steel.

15. A protectively coated wire as claimed in claim 1, wherein said substrate is a steel alloy in which the alloying components are chromium, silicon, copper, nickel and phosphorus.

16. A protectively coated wire as claimed in claim 1, wherein said substrate is a steel alloy in which the alloying elements are manganese, chromium and vanadium.

17. A protectively coated wire as claimed in claim 1, wherein said substrate is an aluminum-containing metallic material.

18. A protectively coated wire as claimed in claim 1, wherein said substrate is galvanized steel wire having a cross-sectional diameter of from about 0.076 to about 0.192 inch.

20. A process as claimed in claim 1, wherein said process is continuous;

said substrate is wire, and said molten resinous hot melt adhesive composition is applied at a temperature of from 300°

F. to 450°

F.

19. A continuous process for applying and bonding a protective coating to a metallic wire substrate that comprises applying to a length of said substrate advancing at a rate of at least 200 feet per minute, a first ply of a molten polyamide resin hot melt adhesive;

said polyamide hot melt adhesive comprising the condensation product of one or more alkylene diamines of the formula;

space="preserve" listing-type="equation">H.sub.2 N(CH.sub.2).sub.x NH.sub.2,

wherein x is an integer of from 2 to 20; and

polymeric fat acids having a dimeric fat acid content greater than about 90 percent by weight;

the molar equivalent of amine employed being about equal to the molar equivalent of carboxyl groups present in said fat acids;

said condensation product having a softening point of 112°

C. to 138°

C. and a tensile strength of from 400 pounds per square foot to 600 pounds per square foot;

cooling the said adhesive composition to a flow resistant state;

extruding a molten extrudable thermoplastic resin composition onto said adhesive composition at a temperature within the range of 300°

C. to 425°

C. in a thickness of at least 0.015 inch whereby said adhesive composition is softened; and

cooling, whereby said thermoplastic resin composition is bonded to said substrate by means of said adhesive composition.

21. A continuous process as claimed in claim 19, wherein said wire is advanced at a rate of from 200 feet per minute to 2000 feet per minute.

22. A continuous process as claimed in claim 19, wherein said polyamide resin hot melt adhesive includes one or more of those alkylene diamines coming within the formula therein recited wherein x is an integer of from 2 to 6 inclusive, and said polyamide resin has a Brookfield melt viscosity of about 10 to 100 poises at 210°

C.; and

a percentage elongation of from 500 to 600.

23. A continuous process as claimed in claim 22, wherein said polyamide adhesive has a Brookfield melt viscosity of about 45 poises at 210°

C.;

a tensile strength of about 500 pounds per square inch; and

a percent elongation of about 550.

24. A process as claimed in claim 19, wherein said extrudable thermoplastic resin is a plasticized vinyl chloride homopolymer.

25. The process as claimed in claim 19, wherein said extrudable thermoplastic plasticized resin employed is a copolymer of vinyl chloride and a vinyl ester having the structure:

##STR3## wherein R is a lower alkyl radical.

26. The process as claimed in claim 25, wherein said vinyl ester is vinyl acetate.

27. The process as claimed in claim 19, wherein said wire is advanced at about 800 feet per minute to 2000 feet per minute.

28. The process as claimed in claim 27 wherein said adhesive composition is deposited upon said wire in a thickness of about 1 to about 5 mils and said vinyl chloride homopolymer compound is extruded onto said adhesive coating in a thickness of about 0.015 to 0.025 inch.

29. The process as claimed in claim 19, wherein said wire is substantially nodule-free galvanized steel wire.

30. The process as claimed in claim 22, wherein the melt viscosity of said polyamide is about 40 to 60 at 210°

C.

31. The process as claimed in claim 28, wherein said wire is galvanized steel wire having a lightly oxidized zinc surface coating.

32. The process as claimed in claim 29, wherein said wire has a cross-section diameter of from bout 0.076 inch to about 0.192 inch.

33. A process for applying a protective coating to a metallic wire and simultaneously bonding said coating thereto that comprises apply, in a first treatment zone, to a rapidly advancing length of said wire a first ply of molten hot melt polyamide adhesive as claimed in claim 19, at a temperature of from 300°

F. to 425°

F. to effect a bonding of said adhesive to said metallic wire;

advancing said adhesive coated substrate to a second treatment zone wherein said adhesive is cooled to a solid, soft, flow-resistant state and thereafter extruding onto said cooled adhesive in a third treatment zone, a molten extrudable thermoplastic plasticized vinyl resin composition, at a temperature sufficient to melt said adhesive and effect a bond between said adhesive and said vinyl resin composition; and

thereafter in a fourth treatment zone reducing the temperature of said advancing coated wire to solidify the bonded coating of adhesive and vinyl resin composition;

said wire being advanced through said treatment zones at a rate of 800 feet per minute to 2000 feet per minute.

34. The process as claimed in claim 32, wherein the treatment zones wherein cooling occurs are maintained at about room temperature.

35. The process as claimed in claim 32, wherein said fourth treatment zone comprises the ambient atmosphere through which the coated wire is advanced after leaving the extruder, and a trough containing a cooling liquid medium through which said coated wire is advanced from said ambient atmosphere.

36. The process as claimed in claim 35, wherein the length of that portion of the fourth treatment zone comprising the ambient atmosphere is a span of about 10 to about 20 feet.

37. The process as claimed in claim 33, wherein said first treatment zone comprises a dipping tank containing said hot melt adhesive and through which said wire is advanced, an exit orifice being defined in the wall of said tank opposite the point of entry of said wire into said tank;

said exit orifice constituting a sizing die of annular cross-sectional conformation to determine the thickness of adhesive coating applied to said wire.

38. The process of claim 33, wherein the residence time of said wire in said fourth treatment zone is from about 0.08 seconds to 6 seconds and said zone is maintained at a temperature of from about 50°

to 70°

F.