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Method of plating the surface of a substrate

  • US 4,241,105 A
  • Filed: 12/17/1979
  • Issued: 12/23/1980
  • Est. Priority Date: 12/17/1979
  • Status: Expired due to Term
First Claim
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1. A method of plating a dielectric surface of a substrate comprising the steps of:

  • (a) coating the substrate with a solution comprising a silver-pyridine complex dissolved in a non-aqueous solvent;

    (b) drying the substrate;

    (c) immersing the substrate in a basic solution whereby the silver-pyridine complex is converted to a silver oxide; and

    (d) reducing the silver oxide to metallic silver.

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