Method of manufacturing a target assembly for a camera tube

• US 4,251,909 A
• Filed: 05/09/1979
• Issued: 02/24/1981
• Est. Priority Date: 06/29/1976
• Status: Expired due to Term

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Hoeberechts, Arthur M. E.
• Primary Examiner(s): Massie, Jerome W.
• Application Number:
  US06/037,267
• Time in Patent Office: 657 Days
• Field of Search: 156/629, 156/630, 156/633, 156/657, 156/662, 156/644, 29/572, 29/577, 29/578, 29/580, 29/589, 29/591, 29/592 R, 313/365, 313/366, 313/367, 313/371, 313/384
• US Class Current: 438/59
• CPC Class Codes: H01J 29/451 with photosensitive junctions
• CPC Class Codes: H01J 29/96 One or more circuit elements structurally associated with the tube
• CPC Class Codes: H01J 31/46 Tubes in which electrical output represents both intensity and colour of image colour television cameras with only one tube H04N23/12
• CPC Class Codes: H01J 9/233 Manufacture of photoelectric screens or charge-storage screens

Abstract

A target and target assembly for a camera tube in which a semiconductor plate is provided on an annular support. The plate has a semiconductor monocrystalline edge portion which comprises an integrated circuit for processing the electrical signals originating from the target. The central portion of the plate is provided with a radiation-sensitive layer having one or more radiation-permeable electrodes. The integrated circuit is provided with inputs which are connected to the electrodes and with leads for the supply and control voltages. A window is provided on the electrodes and overlaps the inner edge of the support, the window, the edge portion and the support adjoining each other in a vacuum-tight manner.

Claims

1. A method of making a target assembly for converting incident radiation into electrical signals for use in a camera tube or the like comprising the steps of:

forming an integrated circuit for processing electrical signals in a peripheral portion of a semiconductor plate; and

providing at least one electrode which is permeable to said radiation and which is connected to an input of said integrated circuit on a central portion of one side of said plate; and

then, in the following order;

securing a window permeable to said radiation to said one side of the plate over said electrode;

forming an opening in a central portion of the other side of said plate to expose a portion of the surface of said electrode remote from said window; and

applying a radiation-sensitive layer to at least said exposed surface portion of said electrode.

2. The method according to claim 1 including the step of providing, on a peripheral portion of said plate, a conductive layer which is connected to an output of said integrated circuit.

3. The method according to claim 2 including the step of securing, in a vacuum tight manner, an annular support of electrically insulating material to said other side of said plate in a manner such that the edge of said window extends at least up to the inner edge of said annular support.

4. The method according to claims 1, 2 or 3 wherein said opening is formed by etching through said central portion of said plate.

5. The method according to claim 4 wherein said plate is of substantially uniform thickness prior to said etching step.

6. The method according to claim 4 wherein said step of providing said electrode includes applying a plurality of spaced, stripe-shaped, mutually parallel permeable electrodes on said one side of said plate.

7. The method according to claim 4 wherein said window overlaps said inner edge of said support.

8. A method of making a camera tube having an envelope with a target assembly at one end and means arranged in the opposite end of said envelope for producing an electron beam for scanning the target, said method comprising the steps of:

forming an integrated circuit for processing electrical signals in a peripheral portion of a semiconductor plate;

providing, on a central portion of one side of said plate, at least one electrode which is permeable to incident radiation and which is connected to an input of said integrated circuit;

providing, on a peripheral portion of said plate, at least one conductive layer which is connected to an output of said integrated circuit; and

securing, in a vacuum tight manner, an annular, electrically insulating support to the other side of said plate; and

then, in the following order;

securing a window permeable to said radiation to said one side of said plate over said electrode in a manner such that the edge of said window extends at least up to the inner edge of said annular support and said conductive layer extends beyond said window;

removing material from the central portion of the other side of said plate to expose a portion of the surface of said electrode remote from said window;

applying a radiation sensitive layer to at least the exposed surface portion of said electrode to thereby form said target assembly; and

securing said target assembly to said one end of said envelope.