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Thermosetting organopolysiloxane compositions

  • US 4,260,726 A
  • Filed: 05/18/1979
  • Issued: 04/07/1981
  • Est. Priority Date: 06/05/1978
  • Status: Expired due to Term
First Claim
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1. A thermosetting organopolysiloxane composition comprising (1) an organosilicon compound having on the average at least two Si-bonded hydrogen atoms per molecule (2) an organosilicon compound containing on the average at least two monovalent hydrocarbon radicals per molecule having aliphatic multiple bonds, (3) a catalyst which promotes the addition of Si-bonded hydrogen to the aliphatic multiple bonds and (4) an organic compound which inhibits curing at room temperature selected from the group consisting of 2-mercaptobenzothiazole, zinc benzothiazylsulfide, dibenzothiazyl disulfide, benzothiazyl-2-N,N-diethylsulfenamide, benzothiazyl-2-N-cyclohexylsulfenamide, benzothiazyl-2-N,N-diisopropylsulfenamide, dithiocarbamic acid, N,N-dimethyldithiocarbamic acid, piperidine-N-pentamethylenedithiocarbamate, zinc-N,N-dibenzyldithiocarbamate, bismuth-N,N-dimethyldithiocarbamate, tellurium-N,N-diethyldithiocarbamate, zinc-N,N-di-n-butyldithiocarbamate, zinc-N,N-dimethyldithiocarbamate, lead di-N,N-methyldithiocarbamate, N,N-tetramethyldithiocarbamylsulfenamide, dithiocarbamylsulfenamide, tetramethylthiuram monosulfide, tetra-n-octadecylthiuram monosulfide, di-N-pentamethylenethiuram monosulfide, tetramethylthiuram disulfide, tetra-n-butylthiuram disulfide and di-N-pentamethylene thiuram tetrasulfide.

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