Thermosetting organopolysiloxane compositions

• US 4,260,726 A
• Filed: 05/18/1979
• Issued: 04/07/1981
• Est. Priority Date: 06/05/1978
• Status: Expired due to Term

• Current Assignee: Wacker-Chemie GmbH (Dr. Alexander Wacker Familiengesellschaft Mit Beschrã¤Nkter Haftung)
• Original Assignee: Wacker-Chemie GmbH (Dr. Alexander Wacker Familiengesellschaft Mit Beschrã¤Nkter Haftung)
• Inventors: Brunner, Erich, Deubzer, Bernward
• Primary Examiner(s): Marquis, Melvyn I.
• Application Number:
  US06/040,342
• Time in Patent Office: 690 Days
• Field of Search: 528/15, 528/31, 528/32
• US Class Current: 528/15
• CPC Class Codes: C08K 5/39 Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
• CPC Class Codes: C08K 5/40 Thiurams, i.e. compounds containing groups
• CPC Class Codes: C08K 5/44 Sulfenamides
• CPC Class Codes: C08K 5/47 Thiazoles
• CPC Class Codes: C08L 83/04 Polysiloxanes

Abstract

Organopolysiloxane compositions which are stable at room temperature, but are curable when subjected to elevated temperatures comprising (1) an organosilicon compound containing Si-bonded hydrogen, (2) an organosilicon compound containing aliphatic multiple bonds, (3) a catalyst capable of promoting the addition of Si-bonded hydrogen to the aliphatic multiple bonds and (4) an organic compound as an additive containing at least one group of the formula ##STR1## in which the additive inhibits curing at room temperature.

Claims

1. A thermosetting organopolysiloxane composition comprising (1) an organosilicon compound having on the average at least two Si-bonded hydrogen atoms per molecule (2) an organosilicon compound containing on the average at least two monovalent hydrocarbon radicals per molecule having aliphatic multiple bonds, (3) a catalyst which promotes the addition of Si-bonded hydrogen to the aliphatic multiple bonds and (4) an organic compound which inhibits curing at room temperature selected from the group consisting of 2-mercaptobenzothiazole, zinc benzothiazylsulfide, dibenzothiazyl disulfide, benzothiazyl-2-N,N-diethylsulfenamide, benzothiazyl-2-N-cyclohexylsulfenamide, benzothiazyl-2-N,N-diisopropylsulfenamide, dithiocarbamic acid, N,N-dimethyldithiocarbamic acid, piperidine-N-pentamethylenedithiocarbamate, zinc-N,N-dibenzyldithiocarbamate, bismuth-N,N-dimethyldithiocarbamate, tellurium-N,N-diethyldithiocarbamate, zinc-N,N-di-n-butyldithiocarbamate, zinc-N,N-dimethyldithiocarbamate, lead di-N,N-methyldithiocarbamate, N,N-tetramethyldithiocarbamylsulfenamide, dithiocarbamylsulfenamide, tetramethylthiuram monosulfide, tetra-n-octadecylthiuram monosulfide, di-N-pentamethylenethiuram monosulfide, tetramethylthiuram disulfide, tetra-n-butylthiuram disulfide and di-N-pentamethylene thiuram tetrasulfide.

2. The composition of claim 1, wherein the organosilicon compound (1) has units of the formula

3. The composition of claims 1 or 2, wherein the organosilicon compound (2) has units of the formula

4. The composition of claims 1 or 2, wherein the catalyst is a platinum catalyst.