Methods for applying phosphors particularly adapted for intagliated phosphor screens

• US 4,264,408 A
• Filed: 06/13/1979
• Issued: 04/28/1981
• Est. Priority Date: 06/13/1979
• Status: Expired due to Term

• Current Assignee: ITT Corporation (ITT, Inc.)
• Original Assignee: International Telephone & Telegraph Corp. (ITT, Inc.)
• Inventors: Benham, James D.
• Primary Examiner(s): Lawrence, Evan K.
• Application Number:
  US06/048,211
• Time in Patent Office: 685 Days
• Field of Search: 427/64, 427/71, 427/72, 427/157, 427/158, 313/372, 313/475, 156/629, 156/663
• US Class Current: 216/25
• CPC Class Codes: C03C 25/00 Surface treatment of fibres or filaments made from glass, minerals or slags
• CPC Class Codes: H01J 29/892 using fibre optics
• CPC Class Codes: H01J 9/227 with luminescent material discontinuously arranged, e.g. in dots or lines

Abstract

A method is described for applying dry phosphor particles on a substrate, such as an intagliated array of fiber optic rods, each etched to form a pit in the surface. In this technique a thin layer of a heated thermoplastic is formed on the surface of the substrate to uniformly coat the etched pits and receive the phosphor particles. The plastic film is heated to receive the particles which are deposited upon the plastic layer. The particles become embedded in the plastic. The plastic layer is removed and the screen is then secured with a binder to fix the particles within the etch pits or cells of the intagliated array.

Claims

1. A method of dry depositing phosphor particles on a substrate, said substrate having an intagliated surface comprising a honeycomb array of a plurality of fiber optic rods, each etched to form a pit in the surface manifesting said array, comprising the steps of:

depositing a thin uniform layer of metal on said intagliated surface to metallize each of said etch pits,

spin coating said intagliated surface of said substrate with a thin thermoplastic film to uniformly coat said metallized etch pits,

heating the assembly to bake the film at a predetermined temperature to soften the same,

depositing dry phosphor particles on the heated thermoplastic coated surface,

removing said thermoplastic coating by heating said substrate at a higher temperature than said predetermined temperature to remove the thermoplastic to cause said particles to enter said metallized etch pits,

binding the particles in place in said etch pits with a binder.

2. The method according to claim 1 wherein said step of spin coating said intagliated surface is provided by uniformly applying a solution of a thermoplastic to said substrate and spinning the coated substrate.

3. The method according to claim 2 wherein said thermoplastic is an acrylic plastic.

4. The method according to claim 1 wherein the step of heating to soften the film includes heating the substrate to a temperature of about 220°

C. for approximately five minutes.

5. The method according to claim 1 wherein the step of depositing phosphor particles includes depositing said particles having a diameter within the range of two to four microns.

6. The method according to claim 1 further including the step of rubbing said assembly after deposition of said particles to remove any excess particles prior to said step of removing said plastic coating.

7. The method according to claim 1 wherein the step of removing said plastic coating includes baking said substrate at a temperature of about 400°

C. for a period of time sufficient to remove said coating.

8. The method according to claim 1 including the step of polishing said surface after removing said plastic coating to remove excess phosphor particles and to smooth said intagliated surface.

9. The method according to claim 1 wherein the step of binding said particles in place includes immersing said assembly in a silicate solution and then spin drying said assembly.

10. The method according to claim 9 wherein said silicate solution is a solution of potassium silicate and said assembly is immersed therein for a period of approximately five minutes.

11. The method according to claim 1 further including the steps of:

lacquering said assembly after binding said particles thereto; and

applying a thin opaque layer of aluminum to said surface of said assembly containing said phosphor particles.

12. The method according to claim 1 wherein said particles of phosphor are zinc sulfide particles.

13. The method according to claim 1 wherein said particles of phosphor are zinc cadmium sulfide particles.

14. The method according to claim 1 wherein said substrate is an intagliated fiber optic array adapted for use as a screen for an image intensifier tube.

15. The method according to claim 1 wherein said pits on said fiber optic surface are approximately between six to ten micrometers in diameter and between ten to twelve micrometers in depth.

16. The method according to claim 1 comprising the step of etching said pits in said fiber optic rods by inserting said array in an etchant solution at a temperature of about 50°

C. for a period determined by the depth of said pit.

17. The method according to claim 16 wherein said etchant solution is a solution of an acid selected from the group consisting of hydrochloric, nitric, phosphoric or hydrofluoric acid.

18. The method according to claim 1 wherein said intagliated substrate is the screen of an image intensifier tube.

19. A method of dry depositing phosphor particles on a surface of an intagliated substrate of the type consisting of a plurality of fused fiber optic cables, each having an etched aperture on a surface to formulate said intagliated surface, comprising the steps of:

spin coating said intagliated surface with an acrylic plastic to uniformly coat said apertures with said plastic,

heating said coated assembly to a temperature of about 200°

C. for a period of approximately five minutes to bake and soften said plastic coating,

uniformly applying dry phosphor particles to said plastic coated surface,

baking said assembly at about 400°

C. for a period of about one hour to remove said acrylic plastic coating to cause said particles to enter said etch pits,

binding said phosphor particles in place in said pits by immersing said assembly in a silicate solution.

20. The method according to claim 19 wherein said step of binding includes immersing in a potassium silicate solution, soaking said substrate in said solution and thereafter spin drying said substrate.

21. The method according to claim 19 wherein said phosphor particles are between two to four microns in diameter and are fabricated from phosphor material.