Low thermal impedance light-emitting diode package

• US 4,267,559 A
• Filed: 09/24/1979
• Issued: 05/12/1981
• Est. Priority Date: 09/24/1979
• Status: Expired due to Term

• Current Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Original Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Inventors: Paola, Carl R., Johnson, Bertrand H.
• Primary Examiner(s): Edlow, Martin H.
• Application Number:
  US06/077,988
• Time in Patent Office: 596 Days
• Field of Search: 357/17, 357/18, 357/81, 357/72
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Disclosed is an assembly for relatively high power light-emitting semiconductor devices that uses simple inexpensive components and construction to provide a heat coupler that reduces the thermal impedance between the active device and the ambient atmosphere by approximately a factor of ten from that of a comparable assembly not incorporating the inventive heat coupler. The active semiconductor device is directly mounted on the heat coupler. The coupler is fabricated from material having good thermal conductivity, such as copper, copper alloys, or aluminum, and is designed to have a large surface area, at least ten times the area of the bonding surface of the active device, in unobstructed contact with the ambient atmosphere, thereby providing efficient heat coupling between the heat source and the ultimate heat sink.

Claims

1. A light-emitting semiconductor assembly comprising

(a) a header;

(b) a heat coupler composed of material having a room-temperature electrical conductivity greater than 2.0·

10⁴ Ω

^-1 ·

cm^-1, and a room-temperature thermal conductivity greater than 0.17 watts cm/cm² ·

°

C., the coupler having at least an external coupling surface adapted to contacting heat-dissipating means, an upper surface, and a lower surface, the header being bonded to the heat coupler at the lower surface;

(c) a light-emitting semiconductor device, having a bonding surface of area not larger than 1/10 of the area of the external coupling surface of the coupler, being bonded at the bonding surface in thermally and electrically conducting relationship to the heat coupler; and

(d) light transmitting means covering the light-emitting device, adapted to transmit light from the device.

2. An assembly according to claim 1 wherein the light-transmitting means comprise an epoxy structure having at least one unconstrained surface.

3. An assembly according to claim 2 wherein the epoxy structure substantially covers the upper surface of the heat coupler and the light-emitting device.

4. An assembly according to claim 3 wherein an epoxy-conformal layer is interposed between the epoxy structure and the light-emitting device.

13. An assembly according to claims 1, 5 or 12 wherein the lower surface of the heat coupler has an indented portion, with the indented portion fitting over at least part of the header.

5. A light-emitting diode assembly comprising

(a) a header;

(b) a heat coupler composed of material having a room temperature electrical conductivity greater than 2.0·

10⁴ Ω

^-1 ·

cm^-1, and a room temperature thermal conductivity greater than 0.17 watts·

cm/cm² ·

°

C., the coupler having at least an external coupling surface adapted to contacting heat-dissipating means, an upper surface, and a lower surface, the header being bonded to the heat coupler at the lower surface;

(c) a light-emitting semiconductor diode, having a bonding surface of area not larger than 1/10 of the area of the external coupling surface of the coupler, the diode being bonded at the bonding surface in electrically and thermally conducting relationship to the heat coupler; and

(d) light-transmitting means covering the light-emitting diode, adapted to transmitting light from the light-emitting diode.

6. An assembly according to claim 5 wherein the light-transmitting means comprise an epoxy structure having at least one unconstrained surface.

7. An assembly according to claim 6 wherein the epoxy structure substantially covers the upper surface of the heat coupler and the light-emitting diode.

8. An assembly according to claim 7 wherein an epoxy-conformal layer is interposed between the epoxy structure and the light-emitting diode.

9. An assembly according to claim 5 wherein the header is a TO-18 header.

10. An assembly according to claim 9 wherein the heat coupler comprises a copper alloy.

11. An assembly according to claim 10 wherein the light-transmitting means consists substantially of epoxy substantially covering the upper surface of the heat coupler and the diode, the light-transmitting means having an unconstrained surface.

12. A light-emitting semiconductor diode assembly comprising

(a) a TO-18 header;

(b) a heat coupler comprising a copper alloy, the coupler having substantially cylindrical shape, with an upper and a lower surface, and a peripheral coupling surface, the header being bonded to the coupler at the lower surface of the coupler;

(c) a light-emitting semiconductor diode chip, having a bonding surface of area not larger than 1/10 of the area of the peripheral coupling surface of the coupler, the diode being bonded at the bonding surface in electrically and thermally conducting relationship to the upper surface of the heat coupler;

(d) an epoxy structure adapted to transmitting light from the diode chip, substantially covering the upper surface of the heat coupler and the diode chip, and having an unconstrained surface; and

(e) an epoxy-conformal layer interposed between the epoxy structure and the diode chip.