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Method for making a chip circuit component

  • US 4,267,634 A
  • Filed: 04/05/1978
  • Issued: 05/19/1981
  • Est. Priority Date: 04/05/1978
  • Status: Expired due to Term
First Claim
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1. A method for making a chip circuit component comprising the steps of:

  • depositing individually a first plurality of thin layers of wet ceramic material in a stacked form on a sheet means and partially drying each of said thin layers of ceramic between each layer deposition thereof;

    depositing a pattern of electrical resistance material in a wet form onto the uppermost, partially dried, ceramic layer in said stack and partially drying said electrical resistance material;

    depositing individually a second plurality of thin layers of wet ceramic material in a stacked form onto the partially dried electrical resistance material and partially drying each of said thin layers of ceramic between each layer deposition thereof;

    further drying the above described stack consisting of the partially dried first plurality of ceramic layers, the partially dried electrical resistance material and the partially dried second plurality of ceramic layers;

    cutting the further dried, above described, stack into a plurality of chips each of which has a section of said electrical resistance material and abutting two edges thereof surrounded by dried ceramic material, firing said plurality of chips until the ceramic material is hardened into a solid ceramic housing; and

    securing terminal means to said two edges of the ceramic material and forming said terminal means integral with the resistance material disposed in said solid ceramic housing.

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