Method for making a chip circuit component
First Claim
1. A method for making a chip circuit component comprising the steps of:
- depositing individually a first plurality of thin layers of wet ceramic material in a stacked form on a sheet means and partially drying each of said thin layers of ceramic between each layer deposition thereof;
depositing a pattern of electrical resistance material in a wet form onto the uppermost, partially dried, ceramic layer in said stack and partially drying said electrical resistance material;
depositing individually a second plurality of thin layers of wet ceramic material in a stacked form onto the partially dried electrical resistance material and partially drying each of said thin layers of ceramic between each layer deposition thereof;
further drying the above described stack consisting of the partially dried first plurality of ceramic layers, the partially dried electrical resistance material and the partially dried second plurality of ceramic layers;
cutting the further dried, above described, stack into a plurality of chips each of which has a section of said electrical resistance material and abutting two edges thereof surrounded by dried ceramic material, firing said plurality of chips until the ceramic material is hardened into a solid ceramic housing; and
securing terminal means to said two edges of the ceramic material and forming said terminal means integral with the resistance material disposed in said solid ceramic housing.
4 Assignments
0 Petitions
Accused Products
Abstract
The present method and device provides that a thickness of wet ceramic material is laid down and partially dried to provide a base. This step is followed by screen printing one or more patterns of electrical resistance material on the upper surface of the partially dried ceramic base. Thereafter a second thickness of said wet ceramic is laid down and partially dried. In the event that the fabricator desires to provide a plurality of resistance paths, or a capacitor, in a single package, the foregoing process can be repeated with additional patterns of resistance material laid down or conductor material for a capacitor laid down, on the upper layer of partially dried ceramic material. The resistance or conductor patterns are sandwiched by additional thicknesses of ceramic materials screen stacked thereon. When the desired package has been achieved, the multi layered arrangement is given a final drying and it is then diced and fired. Thereafter termination means are provided to the fired diced sections, thus making up chip components.
14 Citations
2 Claims
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1. A method for making a chip circuit component comprising the steps of:
- depositing individually a first plurality of thin layers of wet ceramic material in a stacked form on a sheet means and partially drying each of said thin layers of ceramic between each layer deposition thereof;
depositing a pattern of electrical resistance material in a wet form onto the uppermost, partially dried, ceramic layer in said stack and partially drying said electrical resistance material;
depositing individually a second plurality of thin layers of wet ceramic material in a stacked form onto the partially dried electrical resistance material and partially drying each of said thin layers of ceramic between each layer deposition thereof;
further drying the above described stack consisting of the partially dried first plurality of ceramic layers, the partially dried electrical resistance material and the partially dried second plurality of ceramic layers;
cutting the further dried, above described, stack into a plurality of chips each of which has a section of said electrical resistance material and abutting two edges thereof surrounded by dried ceramic material, firing said plurality of chips until the ceramic material is hardened into a solid ceramic housing; and
securing terminal means to said two edges of the ceramic material and forming said terminal means integral with the resistance material disposed in said solid ceramic housing. - View Dependent Claims (2)
- depositing individually a first plurality of thin layers of wet ceramic material in a stacked form on a sheet means and partially drying each of said thin layers of ceramic between each layer deposition thereof;
Specification