Thermal recording elements

• US 4,268,575 A
• Filed: 08/07/1979
• Issued: 05/19/1981
• Est. Priority Date: 08/07/1978
• Status: Expired due to Term

• Current Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Ikeda, Tomoaki, Mizobuchi, Yuzo, Kitajima, Masao, Shinozaki, Fumiaki, Namiki, Tomizo
• Primary Examiner(s): Silverman, Stanley S.
• Application Number:
  US06/064,465
• Time in Patent Office: 651 Days
• Field of Search: 346/76 L, 346/77 R, 346/135.1, 346/137, 428/913, 428/336, 428/339, 428/65, 428/458, 428/460, 428/461, 428/462, 428/463, 428/918, 427/531, 427/162, 427/164, 427/165, 264/1, 358/128.5
• US Class Current: 428/336
• CPC Class Codes: B41M 5/24 Ablative recording, e.g. by burning marks; Spark recording marking by high energetic means, e.g. by laser otherwise than burning or ablative removal B41M5/26; materials or methods for recording or reproduction by optical means G11B7/00
• CPC Class Codes: Y10S 428/913 Material designed to be responsive to temperature, light, moisture
• CPC Class Codes: Y10S 428/918 Material abnormally transparent
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31688 Next to aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31696 Including polyene monomers [e.g., butadiene, etc.]
• CPC Class Codes: Y10T 428/31699 Ester, halide or nitrile of addition polymer

Abstract

A thermal recording element comprising a support having formed thereon a recording layer and formed on the recording layer, a protective layer containing a polymer, and a higher fatty acid having 10 or more carbon atoms or an amide thereof present in or on the protective layer.

Claims

1. In a thermal recording element having formed on a support a recording layer which yields an image on thermal deformation under high intensity irradiation due to a difference in optical density between irradiated areas and non-irradiated areas and a protective layer containing an organic high molecular weight material formed on the recording layer, the improvement wherein a higher fatty acid having more than 10 carbon atoms or the higher fatty acid amide thereof is present in or on the protective layer.

2. The thermal recording element of claim 1, wherein said support is polyethylene terephthalate.

3. The thermal recording element of claim 1, wherein said recording layer is a metal layer.

4. The thermal recording element of claim 3, wherein said recording layer is a layer of Sn, Bi or In.

5. The thermal recording element of claim 3, wherein said recording layer is a layer of GeS, SnS or PbI₂.

6. The thermal recording element of claim 1, wherein said higher fatty acid is lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, oleic acid, linolic acid, or arachidonic acid.

7. The thermal recording element of claim 1, wherein said fatty acid or amide is present in the protective layer.

8. The thermal recording element of claim 1, wherein said fatty acid or amide is present on the protective layer.

9. The thermal recording element of claim 1, wherein said improvement comprises said fatty acid present in or on the protective layer.

10. The thermal recording element of claim 1, wherein said improvement comprises said fatty acid amide present in or on the protective layer.

11. The thermal recording element of claim 1, wherein said recording layer is a laminate of a layer of metal selected from the group consisting of Mg, Sc, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Co, Ni, Ru, Rh, Pd, Ir, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Si, Ge, Te, Pb, Po, Sn, As, Sb, Bi, Se and Te and a layer of another material for increasing recording sensitivity selected from the group consisting of metal oxides, chalcogen compounds, metal halides, As, Sb, P, Ge, Si and Te.

12. The thermal recording element of claim 11, wherein said metal is Sn, Bi or In and said another material is GeS, SnS or PbI₂.

13. The thermal recording element of claim 1, wherein said recording layer is a layer composed of a mixture of a metal selected from the group consisting of Mg, Sc, Y, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Co, Ni, Ru, Rh, Pd, Ir, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Si, Ge, Te, Pb, Po, Sn, As, Sb, Bi, Se and Te and another material for increasing recording sensitivity selected from the group consisting of metal oxides, chalcogen compounds, metal halides, As, Sb, P, Ge, Si and Te.

14. The thermal recording element of claim 13, wherein said metal is Sn, Bi or In and said another material is GeS, SnS or PbI₂.

15. The thermal recording element of claim 1, wherein said improvement comprises said higher fatty acid or amide being in said protective layer in an amount of about 0.1 to 20% by weight based on the weight of the protective layer.

16. The thermal recording element of claim 1, wherein said improvement comprises said higher fatty acid or amide thereof being used as a layer coated on said protective layer at a thickness of about 0.01 to 1 μ

m.