Capacitor of disk shape with liquid cooling

• US 4,271,454 A
• Filed: 03/05/1979
• Issued: 06/02/1981
• Est. Priority Date: 03/14/1978
• Status: Expired due to Term

• Current Assignee: Corning GmbH (Corning Incorporated)
• Original Assignee: Draloric Electronic GmbH
• Inventors: Zeitner, Alfred, Knobl, Alois, Krockow, Helmut, Schmaus, Hermann
• Primary Examiner(s): Goldberg, E. A.
• Application Number:
  US06/016,955
• Time in Patent Office: 820 Days
• Field of Search: 361/274, 361/321
• US Class Current: 361/274.2
• CPC Class Codes: H01G 2/08 Cooling arrangements; Heating arrangements; Ventilating arrangements

Abstract

A liquid cooled capacitor includes a disk comprised of a dielectric, e.g., ceramic, material. On both opposite surfaces of the disk are applied a respective electrode. For cooling each of the electrodes, there is a liquid cooling chamber above it. In one embodiment, there is a contact plate at the base of the liquid cooling chamber. The liquid cooling chamber can receive a circulating flow of liquid therein, and the cooling of the contact plate by the liquid will in turn cool the electrodes. Diametrically oppositely positioned liquid connections to the liquid chamber effect cooling liquid circulation. There is a cover spaced away from the contact plate of the cooling liquid chamber which encloses that chamber. The cooling liquid chamber has a peripheral side wall that extends up from the cooling plate to the spaced away cover. In an alternate embodiment, the liquid chamber includes a plurality of annular liquid coolant-carrying tubes. Diametrically oppositely positioned chambers receive the coolant and distribute same among the cooling tubes. In other embodiments, insulating material is applied around the external periphery of the capacitor and outside the disk, the peripheral walls of the cover plates above the electrodes and outside the periphery of the covers themselves.

Claims

1. A water cooled capacitor, comprising:

(A) a disk made of a dielectric material, said disk having first and second opposed flat main surfaces;

(B) first and second electrodes located on said first and second main surfaces, respectively, so as defined opposed electrodes of said capacitor;

(C) first and second cooling chambers connected to said first electrode at radially opposite locations of said disk;

(D) third and fourth cooling chambers connected to said second electrode at radially opposed locations of said disk;

(E) a first plurality of pipes extending from said first cooling chamber to said second cooling chamber, said first plurality of pipes each defining an arc of a respective circle which is co-axial with said disk, said first plurality of pipes being in contact with said first electrode and providing a fluid path extending between said first and second cooling chambers;

(F) a second plurality of pipes extending from said second cooling chamber to said first cooling chamber, said second plurality of pipes each defining an arc of a respective circle which is co-axial with said disk, said second plurality of pipes being in contact with said first electrode and providing a fluid path extending between said second and first cooling chambers;

(G) a third plurality of pipes extending from said third cooling chamber to said fourth cooling chamber, said third plurality of pipes each defining an arc of a respective circle which is co-axial with said disk, said third plurality of pipes being in contact with said second electrode and providing a fluid path extending between said third and fourth cooling chambers;

(H) a fourth plurality of pipes extending from said fourth cooling chamber to said third cooling chamber, said fourth plurality of pipes each defining an arc of a respective circle which is co-axial with said disk, said fourth plurality of pipes being in contact with said second electrode and providing a fluid path extending between said fourth and third cooling chambers;

(I) a first connection coupled to said first cooling chamber for enabling cooling liquid to be pumped into said first cooling chamber and a second connection coupled to said second cooling chamber for enabling cooling liquid to leave said second cooling chamber whereby liquid pumped into said first cooling chamber circulates through said first and second plurality of pipes, into said second cooling chamber and then out of said second cooling chamber; and

(J) a third connection coupled to said third cooling chamber for enabling cooling liquid to be pumped into said third cooling chamber and a fourth connection coupled to said fourth cooling chamber for enabling cooling liquid to leave said fourth cooling chamber whereby liquid pumped into said third cooling chamber circulates through said third and fourth plurality of pipes, into said fourth cooling chamber and then out of said fourth cooling chamber.

2. The water cooled capacitor of claim 1, further including:

first and second contact plates in contact with said first and second electrodes, respectively; and

first and second annular edge pieces associated with said first and second contact plates, respectively, each of said annular edge pieces having a groove formed therein, said first contact plate having an annular side wall extending from said first electrode into said groove formed in said first annular edge piece, said second contact plate having an annular side wall extending from said second electrode into said groove formed in said second annular edge piece.

3. The water cooled capacitor of claim 1, wherein said first, second, third and fourth plurality of pipes are all equal in number.

4. The water cooled capacitor of claim 3, wherein each pipe in said first plurality of pipes defines an arc of the same circle of a respective one of the pipes of said second plurality of pipes.

5. The water cooled capacitor of claim 4, wherein each of said pipes of said third plurality of pipes defines an arc of the same circle of a respective one of the pipes of said fourth plurality of pipes.