Pressure sensor

• US 4,276,533 A
• Filed: 01/30/1980
• Issued: 06/30/1981
• Est. Priority Date: 02/02/1979
• Status: Expired due to Term

• Current Assignee: Nissan Motor Co., Ltd.
• Original Assignee: Nissan Motor Co., Ltd.
• Inventors: Mihara, Teruyoshi, Tominaga, Tamotsu, Takeuchi, Masami, Oguro, Takeshi
• Primary Examiner(s): Albritton, C. L.
• Application Number:
  US06/116,795
• Time in Patent Office: 517 Days
• Field of Search: 338/2-5, 338/36, 338/42, 73/720, 73/721, 73/726, 73/727, 357/26
• US Class Current: 338/4
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/146 using flexible element between the transducer and the support
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A diaphragm assembly includes a silicon diaphragm block which has a diaphragm at an eccentric position thereof, a diffused resistor formed as a pressure-sensitive element on a front surface of the diaphragm, and a silicon support plate bonded to the diaphragm block so as to cover a back surface of the diaphragm. The diaphragm assembly is accommodated sealingly within and bonded to the inside of a hollow package at an end portion of the assembly remote from the diaphragm in the direction of extension of the bonded surfaces of the block and the support plate. The front surface of the diaphragm and the diffused resistor thereon are exposed to a vacuum while a fluid pressure subject to measurement is introduced through a passage extending through the package and the end portion of the assembly bonded to the package so as to arrive at a back surface of the diaphragm.

Claims

1. A pressure sensor comprising:

(a) a diaphragm assembly including a silicon diaphragm block which has a diaphragm, a diffused resistor formed as a pressure-sensitive element on a front surface of the diaphragm, and a silicon support plate bonded to the diaphragm block so as to cover a back surface of the diaphragm, and a first passage communicating from the back of the diaphragm to an opening in the surface of the diaphragm assembly;

(b) a hollow package sealingly accommodating the diaphragm assembly therein such that the assembly is bonded to the inside of the package at a portion of the assembly remote from the diaphragm in the direction of extension of the bonded surfaces of the block and the support plate, and said portion including the opening to the first passage, and that the front surface of the diaphragm and the diffused resistor thereon are spaced from the inside of the package, and having a second passage formed in the package and communicating from the opening to the first passage to the outside of the package; and

(c) a plurality of terminals extending outside the package and electrically connecting to the diffused resistor.

2. The pressure sensor of claim 1, wherein the diaphragm and the diffused resistor thereon are positioned substantially at an opposite end of the diaphragm block to said opening to the first passage.

3. The pressure sensor of claim 1, wherein the portion of the diaphragm assembly bonded to the package is a part of the outer surface of the support plate.

4. The pressure sensor of claim 3, wherein the support plate is provided on its said outer surface with a groove forming the boundary between the said part of the outer surface thereof and the remaining surface portion thereof.

5. The pressure sensor of claim 1, wherein the diaphragm assembly has an end surface perpendicular to the bonded surfaces of the diaphragm block and the support plate, the diaphragm assembly being bonded to the inside of the package at said end surface.

6. The pressure sensor of claim 1, wherein the first passage is provided by a groove formed in the surface of the diaphragm block bonded to the support plate.

7. The pressure sensor of claim 1, wherein the package is provided with an interior recess on the bottom of which the diaphragm assembly is disposed.

8. The pressure sensor of claim 7, wherein the recess is provided with a smaller recess in the bottom thereof to limit the area of the part of the outer surface of the diaphragm assembly bonded to the package.

9. The pressure sensor of claim 1, wherein the first passage is provided by a groove formed in the surface of the support plate bonded to the diaphragm block.

10. The pressure sensor of any of claims 1 or 9, wherein the interior of the package is evacuated.