Method and apparatus for inspecting printed wiring boards

• US 4,277,175 A
• Filed: 09/11/1979
• Issued: 07/07/1981
• Est. Priority Date: 04/25/1979
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Hara, Yasuhiko, Karasaki, Koichi
• Primary Examiner(s): Punter, William H.
• Application Number:
  US06/074,473
• Time in Patent Office: 665 Days
• Field of Search: 356/376, 356/378, 356/380, 356/384-387, 356/392-394, 356/398, 356/390, 356/237, 356/448, 250/560, 250/563
• US Class Current: 356/394
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01R 31/2806 Apparatus therefor, e.g. test stations, drivers, analysers, conveyors G01R31/2805, G01R31/281, G01R31/2818 take precedence
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates

Abstract

In order that a slight positional deviation of a plated through hole such as having no substantial effect on the function of wiring should not be optically detected as a defect in a printed wiring board, the plated through hole is recognized as a part of the wiring pattern by making light representative of the plated through hole nearly equal in intensity to reflected light from the wiring pattern. This is achieved by illuminating the printed wiring board with light from the back side or by placing a reflector on the back side of the printed wiring board.

Claims

1. A method of inspecting a printed wiring board including and insulating substrate having a wiring surface on which a wiring pattern is provided and including at least one plated through hole being in electrical connection with said wiring pattern and passing through said wiring board, the method comprising the steps of:

illuminating said wiring surface of said printed wiring board with light to obtain an optical image of said wiring surface at least by the use of reflected light from said wiring surface;

recognizing the light intensity of the optical images of said wiring pattern and that of the plated through hole as being at an identical first level of two digitized levels in said optical image of said wiring surface without distinguishing therebetween; and

recognizing the light intensity of the optical image of said insulating substrate as being at a second level of said two digitized levels different from that of said light intensity of said wiring pattern and said plated through hole to distinguish said optical image of said insulating substrate from said images of said wiring pattern and said plated through hole.

2. A method according to claim 1, wherein the back side of said printed wiring board is illuminated with light capable of bringing said optical image of said plated through hole at the same light level as said optical image of said wiring pattern.

3. A method according to claim 1, wherein light having passed through said plated through hole to the back side of said printed wiring board is reflected back from a reflector capable of producing reflected light which is directed to said plated through hole and can bring said optical image of said plated hole at the same light level as said optical image of said wiring pattern.

4. An apparatus for inspecting printed wiring boards, comprising:

first means for recognizing an optical image of a wiring surface of a printed wiring board, said optical image being formed at least by the use of reflected light from said wiring surface of said printed wiring board;

second means for recognizing an optical image of a wiring surface of another printed wiring board, said optical image being formed at least by the use of reflected light from said wiring surface of said another printed wiring board; and

means for collating said optical images recognized respectively by said first and second recognizing means, wherein each of said first and second optical-image recognizing means includes a binary coder for converting both an optical image of a wiring pattern and an optical image of a plated through hole into signals of an identical first level of two digitized light levels and for converting an optical image of an insulating substrate into a signal of a second level of said two digitized light levels different from said first level.

5. An apparatus according to claim 4 including a first light source for generating light incident upon each of said wiring surfaces to form an optical image of said wiring surface, and a second light source for generating light travelling from the back side of each of said printed wiring boards to each of said first and second optical-image recognizing means through said plated through hole.

6. An apparatus according to claim 4, including a light source for generating light incident upon each of said wiring surfaces to form an optical image of said wiring surface, and a reflector placed in close vicinity to the back side of each of said printed wiring boards for reflecting back light arriving at said back side through said plated through hole, to produce reflected light directed to said plated through hole.

7. An apparatus according to claim 6, wherein said reflector is a mirror.

8. An apparatus according to claim 6, wherein said reflector is a plate coated with a white paint having a high reflectivity.

9. An apparatus according to claim 6, wherein said reflector is a plate having a white paper provided on the surface thereof.