High-radiance emitters with integral microlens
First Claim
1. A process for making a radiation emitting semiconductor device comprising the steps of depositing an oxide on one side of an emitting device structure having an emitting junction, selectively removing an annular region of the oxide, selectively etching the exposed annular portion of the device structure to form a mesa type structure, selectively removing the oxide over the mesa structure and then selectively etching further to round the top of the mesa structure.
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Abstract
This invention deals with the fabrication of radiation emitting diodes having a small diameter shaped integral microlens formed by etching. Initially an oxide layer is deposited on the backside of the processed slice; then a ring pattern is opened in the oxide. An etch is used to form a ring groove with a mesa in the center. The center oxide dot over the mesa is removed and the etching continued to round off the edges of the mesa and to form a smooth shaped structure. Various shapes and diameters may be achieved with different ring dimensions and with different etch times.
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Citations
4 Claims
- 1. A process for making a radiation emitting semiconductor device comprising the steps of depositing an oxide on one side of an emitting device structure having an emitting junction, selectively removing an annular region of the oxide, selectively etching the exposed annular portion of the device structure to form a mesa type structure, selectively removing the oxide over the mesa structure and then selectively etching further to round the top of the mesa structure.
Specification
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- Resources
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Current AssigneeTexas Instruments, Inc.
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Original AssigneeTexas Instruments, Inc.
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InventorsDierschke, Eugene G.
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Primary Examiner(s)Smith, Ronald H.
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Assistant Examiner(s)Bueker, Richard
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Application NumberUS05/834,211Time in Patent Office1,401 DaysField of Search313/498, 313/499, 313/110, 357/17, 156/662, 156/654, 156/656, 156/648, 156/649, 427/77US Class Current438/29CPC Class CodesH01L 33/0093 Wafer bonding; Removal of t...H01L 33/20 with a particular shape, e....H01L 33/46 Reflective coating, e.g. di...
