Siloxane-modified epoxy resin compositions
First Claim
1. A siloxane-modified epoxy resin composition consisting essentially of (A) 100 parts by weight of a siloxane-modified epoxy resin prepared by reacting (1) 5 to 70 parts by weight of an alkylphenylpolysiloxane of the general unit formula
wherein each R is an alkyl or phenyl radical such that the ratio of alkyl radicals to phenyl radicals in the alkylphenylpolysiloxane is 0.3 to 3.0, X is an alkoxy radical or a hydroxyl radical, a is 0.9 to 1.8, and b is 0.01 to 2 with (2) 95 to 30 parts by weight of an epoxy resin having at least two epoxy groups per molecule, (B) 0.01 to 100 parts by weight of an organosilicon compound having attached to silicon an alkoxy radical and a monovalent organic radical containing a functional group selected from the group consisting of an epoxy group, a methacryl group and an amino group and (C) a curing agent for (A).
1 Assignment
0 Petitions
Accused Products
Abstract
Compositions containing siloxane-modified epoxy resins, epoxy, methacryl, or amino organofunctional alkoxysilicon compound and conventional epoxy curing agents are described which have improved resistance to degradation of both electrical properties and adhesion when exposed to moisture or boiling water. The compositions consist essentially of (A) siloxane-modified epoxy resin, (B) an organofunctional alkoxysilicon compound such as γ-aminopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, or γ-glycidoxypropyltrimethoxysilane, and (C) curing agents such as carboxylic acid anhydrides.
-
Citations
10 Claims
- 1. A siloxane-modified epoxy resin composition consisting essentially of (A) 100 parts by weight of a siloxane-modified epoxy resin prepared by reacting (1) 5 to 70 parts by weight of an alkylphenylpolysiloxane of the general unit formula
- space="preserve" listing-type="equation">R.sub.a SiX.sub.b O(4-a-b/2)
wherein each R is an alkyl or phenyl radical such that the ratio of alkyl radicals to phenyl radicals in the alkylphenylpolysiloxane is 0.3 to 3.0, X is an alkoxy radical or a hydroxyl radical, a is 0.9 to 1.8, and b is 0.01 to 2 with (2) 95 to 30 parts by weight of an epoxy resin having at least two epoxy groups per molecule, (B) 0.01 to 100 parts by weight of an organosilicon compound having attached to silicon an alkoxy radical and a monovalent organic radical containing a functional group selected from the group consisting of an epoxy group, a methacryl group and an amino group and (C) a curing agent for (A). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
Specification