Siloxane-modified epoxy resin compositions

• US 4,287,326 A
• Filed: 03/03/1980
• Issued: 09/01/1981
• Est. Priority Date: 03/03/1980
• Status: Expired due to Term

• Current Assignee: Toray Silicone Co Ltd (Toray Industries Incorporated)
• Original Assignee: Toray Silicone Co Ltd (Toray Industries Incorporated)
• Inventors: Mikami, Ryuzo
• Primary Examiner(s): BRIGGS SR, WILBERT
• Application Number:
  US06/126,231
• Time in Patent Office: 547 Days
• Field of Search: 525/476
• US Class Current: 525/476
• CPC Class Codes: C08G 59/02 Polycondensates containing more than one epoxy group per molecule
• CPC Class Codes: C08K 5/0025 Crosslinking or vulcanising agents; including accelerators
• CPC Class Codes: C08K 5/54 Silicon-containing compounds C08K5/0091 takes precedence
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/10 Block- or graft-copolymers containing polysiloxane sequences obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C08L51/08, C08L53/00

Abstract

Compositions containing siloxane-modified epoxy resins, epoxy, methacryl, or amino organofunctional alkoxysilicon compound and conventional epoxy curing agents are described which have improved resistance to degradation of both electrical properties and adhesion when exposed to moisture or boiling water. The compositions consist essentially of (A) siloxane-modified epoxy resin, (B) an organofunctional alkoxysilicon compound such as γ-aminopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, or γ-glycidoxypropyltrimethoxysilane, and (C) curing agents such as carboxylic acid anhydrides.

Claims

1. A siloxane-modified epoxy resin composition consisting essentially of (A) 100 parts by weight of a siloxane-modified epoxy resin prepared by reacting (1) 5 to 70 parts by weight of an alkylphenylpolysiloxane of the general unit formula

View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)

2. A siloxane-modified epoxy resin composition according to claim 1 in which siloxane epoxy resin (A) is prepared by reacting 15 to 50 parts by weight (1) with 85 to 50 parts by weight (2) at 120°

to 210°

C.

3. A siloxane-modified epoxy resin composition according to claim 2 in which the epoxy resin (2) is a polydiglycidyl ether of bisphenol A resin.

4. A siloxane-modified epoxy resin composition according to claim 3 in which the epoxy resin has a molecular weight of 340 to 6000.

5. A siloxane-modified epoxy resin composition according to claim 4 containing 0.5 to 50 parts by weight of organosilicon compound (B).

6. A siloxane-modified epoxy resin composition according to claim 5 in which the organosilicon compound (B) has the general formula ##STR4## wherein Z is a monovalent organic radical containing a functional group selected from the group consisting of an epoxy group, a methacryl group and an amino group, Y is a lower alkoxy radical, R'"'"' is a hydrogen atom or a monovalent hydrocarbon radical, m and n are integers from 1 to 3 and m+n does not exceed 4.

7. A siloxane-modified epoxy resin composition according to claim 5 in which the organosilicon compound (B) is an organopolysiloxane with a degree of polymerization of 2 to 30.

8. A siloxane-modified epoxy resin composition according to claim 5 containing a curing agent (C) selected from the group consisting of polyhydric carboxylic acids and polyhydric carboxylic acid anhydrides.

9. A siloxane-modified epoxy resin composition according to claim 8 in which the curing agent (C) is trimellitic anhydride.

10. A siloxane-modified epoxy resin composition according to claim 8 in which the curing agent (C) is hexahydrophthalic anhydride.