Piezoelectric and pyroelectric film and method for preparing the film

• US 4,290,983 A
• Filed: 11/19/1979
• Issued: 09/22/1981
• Est. Priority Date: 11/21/1978
• Status: Expired due to Term

• Current Assignee: Kureha Kagaku Kogyo Kabushiki Kaisha
• Original Assignee: Kureha Kagaku Kogyo Kabushiki Kaisha
• Inventors: Sasaki, Tohru, Susa, Tomoo, Terasaki, Syuuzi
• Primary Examiner(s): Lowe, James B.
• Application Number:
  US06/095,379
• Time in Patent Office: 673 Days
• Field of Search: 264/22, 264/288.8, 264/290.2, 427/100, 427/12, 29/25.35, 179/111 E, 307/400, 310/357
• US Class Current: 264/435
• CPC Class Codes: H10N 15/10 Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
• CPC Class Codes: H10N 30/045 by polarising
• CPC Class Codes: H10N 30/098 Forming organic materials
• CPC Class Codes: H10N 30/857 Macromolecular compositions
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A piezoelectric and pyroelectric film made from a resin composition of polymer of vinylidene fluoride, which is characterized by an index of birefringence of larger than 3×10^-3 and a ratio of d₃₁ /d₃₂ of 0.3 to 3.0, and which may be prepared by further stretching a biaxially stretched film made from the above-mentioned resin composition at a temperature lower than the temperature of the biaxially stretching by more than 20° C. before or at the same time of a treatment for orientation polarization of the film.

Claims

1. A method for preparing a piezoelectric and pyroelectric film comprising the steps of,

biaxially stretching a film made from a resin

composition of a polymer of vinylidene fluoride;

additionally stretching the thus obtained biaxially stretched film at a temperature of lower than the crystallizing temperature of said resin composition, which additional stretching temperature is lower than the temperature at the biaxially stretching by more than 20°

C. and is higher than the secondary transition temperature of said resin composition; and

at the same time or after the additional stretching polarizing the thus additionally stretched film

2. The method according to claim 1, wherein said resin composition comprises a homopolymer or copolymer of vinylidene fluoride.

3. The method according to claim 1, wherein the temperature at which said additional stretching is carried out is lower than the temperature at which biaxial stretching is carried out by more than 40°

C.

4. The method according to claim 3, wherein said additional stretching is carried out at a temperature more than 60°

C. below the temperature at which the biaxial stretching is carried out.

5. The method according to claim 1, wherein said additional stretching is carried out onto said biaxially stretched film in a state of molecular orientation of a degree higher than -5×

10^-3 in the direction of said biaxial stretching.

6. The method according to claim 1, wherein said biaxially stretched film prior to said additional stretching is in a state of molecular orientation of the degree of 14×

10^-3 to 22×

10^-3 in the direction of the first monoaxial stretching after the first monoaxial stretching constituting said biaxial stretching and is in a state of molecular orientation of a degree of higher than -5×

10^-3 in the direction of second monoaxial stretching after the second monoaxial stretching, said first and second monoaxial stretchings constituting said biaxial stretching.

7. The method according to claim 6, wherein the direction of said additional stretching is perpendicular to the direction of the second monoaxial stretching constituting said biaxial stretching or oblique to either of the direction of the first stretching or the second stretching.

8. The method according to claim 1, wherein said additional stretching is a multiple stage-stretching having two or more steps of stretching.