Preparation of boiling heat transfer surface

• US 4,291,758 A
• Filed: 10/03/1979
• Issued: 09/29/1981
• Est. Priority Date: 10/31/1978
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Morihiro, Yoshiyuki, Fujii, Masao, Ogawa, Yoshifusa
• Primary Examiner(s): Richter, Sheldon J.
• Application Number:
  US06/081,438
• Time in Patent Office: 727 Days
• Field of Search: 62/527, 165/133, 165/DIG. 10
• US Class Current: 165/133
• CPC Class Codes: F28F 13/187 especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
• CPC Class Codes: Y10S 165/907 Porous

Abstract

A boiling heat transfer surface for heat transfer between a heat source and a coolant is provided. On the heat transfer surface contacting with a liquid coolant such as fluorinated hydrocarbon type liquid coolants, metallic particles having grain size of 60 mesh pass and 250 mesh nonpass (Japanese Industrial Standard sieve) are piled up and fixed by a metallic film on the heat transfer surface.

Claims

1. A boiling heat transfer surface for contacting with a liquid coolant, comprising a porous layer on a substrate, said porous layer formed of:

a layer of metallic particles having grain sizes of between 60 mesh pass and 250 mesh non-pass, said layer being at least one particle thick and defining interstices between said particles; and

a metallic film plated on said particles and fixing said particles to one another and to said substrate, said metallic film having a substantially uniform thickness on each said particle greater than 10μ

but not sufficiently great to fill said interstices,

whereby said interstices form at least some of the pores of said porous layer.

2. A boiling heat transfer surface according to claim 1 wherein the metallic film is made of nickel.

3. The surface of claim 1, wherein said plated metallic film is coated by dipping said layer of said metallic particles in a metallic plating solution.