Ceramic lid assembly for hermetic sealing of a semiconductor chip

• US 4,291,815 A
• Filed: 02/19/1980
• Issued: 09/29/1981
• Est. Priority Date: 02/19/1980
• Status: Expired due to Term

• Current Assignee: SEMX Corp. (Ametek Incorporated)
• Original Assignee: Consolidated Refining Company Incorporated
• Inventors: Gordon, Richard, Ciallella, John G.
• Primary Examiner(s): Hall, George T.
• Application Number:
  US06/122,527
• Time in Patent Office: 588 Days
• Field of Search: 220/200, 220/359, 174/52 S, 174/68.5, 174/52 FP, 156/330, 156/60, 156/306, 206/813, 206/328, 206/329, 29/588, 29/492, 219/87, 252/514
• US Class Current: 220/200
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a flowed solderable layer in registration with each other in the hermetic sealing area.

Claims

1. A lid assembly for hermetic sealing of a package containing a semiconductor chip comprising:

a lid of dielectric material including an integral heat fusible metallic layer deposited on said lid in a peripheral region defining a hermetic sealing area.

2. The lid assembly as set forth in claim 1 wherein said integral heat fusible layer includes a metallized heat fusible layer and a solderable heat fusible layer in registration therewith.

3. The lid assembly as set forth in claim 2 wherein said metallized layer and said solderable layer are provided as a fired printed heat fusible layer.

4. The lid assembly as set forth in claim 2 wherein said metallized layer includes a fired printed heat fusible layer and said solderable layer includes a preform of a solderable alloy flowed thereto.

5. The lid assembly as set forth in claim 2 further including an oxidation inhibiting layer disposed between said metallized layer and said solderable layer.

6. A dielectric lid assembly for hermetic sealing of a package containing a semiconnector chip comprising a ceramic lid, a printed metallized heat fusible layer deposited on said ceramic lid in a peripheral region defining a hermetic sealing area, and a solderable heat fusible layer disposed on said metallized layer in registration therewith.

7. The lid assembly as set forth in claim 6 further including an oxidation inhibiting layer disposed between said metallized layer and said solderable layer.

8. The lid assembly as set forth in claim 6 wherein said solderable layer includes a fired printed heat fusible layer or a heat fusible preform of solder alloy composition.

9. The lid assembly as set forth in claim 6 wherein said solderable layer is a composition of lead, tin and silver.

10. The lid assembly as set forth in claim 6 wherein said metallized layer includes a composition of molybdenum and manganese.