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Hermetic plastic dual-in-line package for a semiconductor integrated circuit

  • US 4,298,769 A
  • Filed: 01/28/1981
  • Issued: 11/03/1981
  • Est. Priority Date: 12/14/1979
  • Status: Expired due to Term
First Claim
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1. A hermetic package for a semiconductor chip, said package comprising a ceramic chip carrier including a recessed portion having a bottom surface and at least one raised surface surrounding said recessed portion, a plurality of spaced conducting fingers arranged on said raised surface and extending to and terminating at the bottom surface of said chip carrier, a semiconductor chip in said recessed portion and including a plurality of bonding locations thereon, a corresponding plurality of bonding wires connected between said bonding locations and selected ones of said conducting fingers, a lid covering said carrier and sealing said chip within said carrier, and a lead frame separate from said chip carrier and having a significantly larger surface area than that of said chip carrier, said lead frame including a plurality of substantially rigid but bendable space leads constituting a free-standing assembly, each of said leads including spaced inner ends extending inwardly toward and terminating at a central portion of said lead frame to define the periphery of a central opening in said lead frame, said chip carrier being mounted to said lead frame over said central opening and being supported by said inner ends of said leads, said inner ends of said leads also being electrically connected to said conducting fingers at the bottom surface of said chip carrier, each of said leads further including an angular intermediate portion integral with and projecting away from said inner end and an outer portion integral with said intermediate portion and bent downward from said intermediate portion in a direction substantially perpendicular to said intermediate portion, said outer portions of said leads being spaced and substantially parallel to one another and defining the external connections for the package.

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