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Molybdenum substrate thick film circuit

  • US 4,313,262 A
  • Filed: 12/17/1979
  • Issued: 02/02/1982
  • Est. Priority Date: 12/17/1979
  • Status: Expired due to Term
First Claim
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1. A method of making a large area multilayer printed circuit structure comprising:

  • a. providing a substrate material made of molybdenum;

    b. screen printing a first layer of dielectric material and allowing said dielectric to dry;

    c. firing said first dielectric layer;

    d. repeating steps b and c until the desired number of dielectric layers have been printed, said dielectric layers having an uppermost dielectric layer with a top surface;

    e. screen printing a first conductor circuit over the top surface of the uppermost dielectric layer and allowing said first conductor to dry;

    f. firing said first conductor, said first conductor having a top surface;

    g. screen printing a second layer of dielectric material over the top surface of said first conductor and the uppermost layer of said first dielectric layers and allowing said second dielectric layer to dry;

    h. firing said second dielectric; and

    i. repeating steps e, f, g and h until the desired number of dielectric-conductor layers have been printed.

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