Pressure sensor having semiconductor diaphragm

• US 4,314,225 A
• Filed: 07/09/1979
• Issued: 02/02/1982
• Est. Priority Date: 08/10/1978
• Status: Expired due to Term

• Current Assignee: Nissan Motor Co., Ltd.
• Original Assignee: Nissan Motor Co., Ltd.
• Inventors: Mihara, Teruyoshi, Tominaga, Tamotsu
• Primary Examiner(s): Grimley, Arthur T.
• Assistant Examiner(s): Borchelt, E. F.
• Application Number:
  US06/055,755
• Time in Patent Office: 939 Days
• Field of Search: 338/2, 338/4, 338/42, 73/719, 73/720, 73/721, 73/727, 73/754, 73/777, 228/263 A, 228/122, 228/124, 29/610 SG, 357/26, 310/313 R, 310/338, 361/417
• US Class Current: 338/4
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/146 using flexible element between the transducer and the support
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]

Abstract

A pressure sensor of the type having a semiconductor diaphragm such as a silicon diaphragm which is formed with at least one diffused resistor in a surface region on one side thereof. A silicon block having the diaphragm is bonded to the inside of a box-like package such that the diffused resistor is exposed in a vacuum chamber defined in the package and that a fluid pressure can arrive at the back side of the diaphragm through a hole of the package. To minimize unwanted straining of the silicon diaphragm by thermal influences, the package is made of a material such as mullite whose linear expansion coefficient is close to that of silicon. To prevent an accidental change in the output characteristic of the sensor by the influence of an unintended external force, the package is supported above a base plate by pillar-like lead frames and confined in a space provided by fixing a cap to the base plate. A pressure introduction pipe is attached to either the base plate or the cap.

Claims

1. A pressure sensor comprising:

(a) a probe assembly comprising

(i) a pressure-sensitive element comprising a block of a crystalline semiconductor a portion of which takes the form of a diaphragm having front and back sides and at least one diffused resistor formed in a surface region on said front side of said diaphragm;

(ii) a package made up of at least two structural members integrated into a lidded box-like structure, said structural members being each made of an electrically nonconductive material whose coefficient of linear expansion is nearly equal to the coefficient of linear expansion of said crystalline semiconductor, said block of said pressure-sensitive element being confined in the interior of said package and bonded to one of said at least two structural members such that said diaphragm is entirely spaced apart from the inside of said package and that a hermetically closed first space is defined between the inside of said package and said front side of said diaphragm, said space being kept at a predetermined pressure so as to serve as a reference pressure chamber, said one of said at least two structural members further including a first hole bored therethrough in such a position that a fluid pressure subject to measurement can be admitted into the interior of said package through said hole so as to arrive at said back side of said diaphragm; and

(iii) a plurality of lead frames which are elongate metal members fixed to said package so as to each protrude from the outside of said package and electrically connected to said at least one diffused resistor said lead frames comprising means for supporting the weight of said package;

(b) a base plate having a plurality of electrical terminals, said lead frames being respectively fixed to said base plate at said electrical terminals such that said package is supported by said lead frames in a state entirely spaced from said base plate;

(c) a cap fixed to said base plate such that a second space is defined between said cap and said base plate and that said probe assembly is entirely confined in said second space and spaced from the inside of said cap, one of said cap and said base plate having a second hole bored therethrough so as to open into said second space; and

(d) a pipe fixed to said one of said cap and said base plate such that the interior of said pipe communicates with said second space only through said second hole to introduce said fluid pressure into said second space.

2. A pressure sensor according to claim 1, wherein said crystalline semiconductor is crystalline silicon.

3. A pressure sensor according to claim 2, wherein said at least two structural members are each made of a material selected from the group consisting of mullite and zircon.

4. A pressure sensor according to claim 3, wherein said block is bonded to the inside of said package with a bonding layer comprising a thin metal layer intimately coated on the inside of said package at least in a selected area, a thin layer of gold plated on said metal layer and a thin layer of an eutectic alloy of gold with silicon formed at the interface between said block and said layer of gold.

5. A pressure sensor according to claim 4, wherein said metal layer is a combination of a thin layer of tungsten in direct contact with the inside of said package and a thin layer of nickel coated on said layer of tungsten.

6. A pressure sensor according to claim 1, wherein said package further comprises a plurality of electrical terminals fixed to the inside of said package and electrically connected respectively to said lead frames, said at least one diffused resistor being electrically connected to said terminals in said package by a plurality of metal wires extending in said first space.

7. A pressure sensor according to claim 1, wherein said at least two structural members are each fixed to an adjacent one with a hermetic bonding layer.

8. A pressure sensor according to claim 7, wherein said first space is evacuated.

9. A pressure sensor according to claim 4 or 7, wherein said package is an integration of a platy base which has said first hole, a frame which is a platy member having an opening in a central region thereof and bonded to said base such that said first hole communicates with said opening and a cap member bonded to said frame, said opening being larger in cross-sectional area than said block, said block of said pressure-sensitive element being bonded to said base so as to constitute a barrier to the communication of said first hole with at least a major volume of said opening.