Latch-up prevention circuit for power output devices using inductive loads

• US 4,322,770 A
• Filed: 02/28/1980
• Issued: 03/30/1982
• Est. Priority Date: 02/28/1980
• Status: Expired due to Term

• Current Assignee: RCA Corporation
• Original Assignee: RCA Corporation
• Inventors: Sendelweck, Gene K.
• Primary Examiner(s): Salce, Patrick R.
• Application Number:
  US06/125,647
• Time in Patent Office: 761 Days
• Field of Search: 361/91, 361/111, 361/110, 361/88, 361/56, 361/90, 330/207 P, 330/298, 307/303
• US Class Current: 361/91.5
• CPC Class Codes: H03F 1/52 Circuit arrangements for protecting such amplifiers monitoring arrangements G01R31/28; increasing reliability in communication systems, e.g. using redundancy H04B1/74
• CPC Class Codes: H03K 17/64 having inductive loads

Abstract

A circuit arrangement is provided which prevents latching in a power amplifier or supply. A power output transistor drives an inductive load, which is coupled in parallel with the collector-to-emitter path of the transistor. A first diode is coupled between the transistor and a point of reference potential, and is in series with the collector-to-emitter path of the transistor and poled to be of like polarity to the base-emitter junction of the transistor. A capacitor is coupled in parallel with the first diode, and a second diode is coupled in parallel with the inductive load and is poled in an opposite sense to the first diode. The second diode is chosen to have a voltage drop such that a negative voltage impulse from the inductive load will be clipped at a voltage which is the difference between the voltage drops of the first and second diodes.

Claims

1. A power output circuit which is prevented from latching due to voltage pulses developed by an inductive load comprising:

a monolithic integrated circuit chip including a semiconductor substrate of one type conductivity coupled to a point of reference potential, means for developing a control signal, and a transistor having a base coupled to receive said control signal, an emitter coupled to a first terminal, and a collector of opposite type conductivity coupled to a second terminal, said collector and said substrate forming a diode junction;

a first diode, located external to said integrated circuit chip, coupled between said first terminal and said point of reference potential, and forward biased so as to maintain a given potential difference between said reference potential and the potential at said first terminal;

a second diode, located external to said integrated circuit chip and coupled between said first and second terminals in parallel with the collector-to-emitter path of said transistor, and poled for conduction in a direction opposite to the forward biased conduction direction of the collector-to-emitter path of said transistor at a first threshold level at said collector electrode of said transistor which is substantially equal to the difference between said potential at said first terminal and the forward biased voltage drop of said second diode; and

means located external to said integrated circuit chip, for coupling said inductive load between said first and second terminals in parallel with said collector-to-emitter path of said transistor,

wherein voltage pulses developed by said inductive load at said collector electrode of said transistor render said second diode conductive at said first threshold level, which is attained by said voltage pulses prior to attaining a second threshold level which is sufficient to forward bias said diode junction.

4. The power output circuit of claim 1 further comprising:

a capacitor located external to said integrated circuit chip and coupled in parallel with said first diode; and

a semiconductive region, located on said integrated circuit chip in close proximity to said collector of said transistor, and coupled to said first terminal, said region forming, in combination with said collector, a second diode junction which becomes forward biased by said voltage pulses at a third threshold level which is attained by said voltage pulses prior to the attainment of said second threshold level.

5. The power output circuit of claim 4, wherein said third threshold level is substantially equal to said reference potential.

2. The power output circuit of claim 2 wherein said second diode forms a loop circuit with said inductive load to conduct current resulting from said voltage pulse in said loop, external to said integrated circuit chip.

3. The power output circuit of claim 2

wherein said second threshold level is substantially equal to the difference between said reference potential and the forward biased voltage drop of said diode junction formed by said collector and said substrate.