Heat pipe cooling arrangement for integrated circuit chips

• US 4,327,399 A
• Filed: 12/27/1979
• Issued: 04/27/1982
• Est. Priority Date: 01/12/1979
• Status: Expired due to Term

• Current Assignee: Nippon Telegraph and Telephone Corporation
• Original Assignee: Nippon Telegraph and Telephone Corporation
• Inventors: Sasaki, Etsuro, Ohsaki, Takaaki
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US06/107,646
• Time in Patent Office: 852 Days
• Field of Search: 357/81, 357/82, 361/381, 361/382, 361/385, 361/401, 174/15 HP, 165/32, 165/105
• US Class Current: 361/698
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/538 the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A heat pipe structure comprises a wiring substrate consisting of ceramic or silicon having a cavity in the interior on the inner surface of which is formed a wick and which contains working fluid, and radiating fins formed at the end of the substrate. Integrated circuit elements, integrated circuits or integrated circuit devices are securely inserted in holes which are formed on the surface or the back of the substrate and which communicate with the cavity so that the wick on their backs is aligned with the wick on the inner surface of the cavity for directly cooling the integrated circuit elements, the integrated circuits or the integrated circuit devices.

Claims

1. An integrated circuit construction comprising a heat pipe structure wiring substrate having a cavity in its interior, a heat pipe wick on the inner surface of said cavity, and a cooling device attached on the end of said substrate;

at least one hole provided in this heat pipe structure wiring substrate to communicate with said cavity;

a single crystal substrate with semiconductor integrated circuit devices attached thereto securely fixed within this hole and with a wick similar to said heat pipe wick disposed on the inner surface of the cavity; and

a working fluid sealed within said cavity and directly contacting said single crystal substrate via said single crystal substrate wick.

2. An integrated circuit construction as defined in claim 1 in which said heat pipe structure substrate is made of ceramic.

3. An integrated circuit construction as defined in claim 1 in which said heat pipe structure substrate is made of silicon.

4. An integrated circuit construction as defined in claim 1 in which integrated circuit elements are provided on said single crystal substrate for semi.

5. An integrated circuit construction as defined in claim 1 in which an integrated circuit is formed on the entire surface of said single crystal substrate for.

6. An integrated circuit construction as defined in claim 4 in which the integrated circuit elements are embedded in at least one recess provided on said single crystal substrate for.

7. An integrated circuit construction as defined in claim 1 in which said working fluid comprises any one of fluid pure water, alcohol, ammonia, freon, etc.

8. An integrated circuit construction as defined in claim 1 in which said cooling device comprises air-cooled radiating fins.

9. An integrated circuit construction as defined in claim 1 in which said cooling device comprises a water-cooled jacket.

10. An integrated circuit construction as defined in claim 1 in which said hole is tapered.

11. An integrated circuit construction as defined in claim 1 in which said hole is provided with a projection extending from the wiring substrate.

12. An integrated circuit construction as defined in claim 1 in which a plurality of said holes communicating with the cavity are provided on an upper, lower or both surfaces of the wiring substrate.

13. An integrated circuit construction as defined in claim 1 in which a soft alloy solder, such as indium-tin, indium-tin-lead, etc., is used as adhesive between said hole communicating to the cavity and the single crystal substrate.