Tape operated semiconductor device packaging

• US 4,330,790 A
• Filed: 03/24/1980
• Issued: 05/18/1982
• Est. Priority Date: 03/24/1980
• Status: Expired due to Term

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Burns, Carmen D.
• Primary Examiner(s): Husar, Francis S.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US06/133,040
• Time in Patent Office: 785 Days
• Field of Search: 29/827, 29/588, 29/841, 357/72, 357/70, 174/52 PE, 174/52 S, 228/180 A, 361/421
• US Class Current: 257/671
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

A semiconductor device is bonded to a contact finger pattern which is located in a continuous tape. A metal package cup is fabricated from metal stock so as to have a flat rim portion around its periphery. A plastic insulating sheet is punched so that it forms an overlapping cover for the flat rim and is attached thereto. The tape mounted semiconductor device is then bonded to the inside of the cup and the metal fingers bonded to the insulating sheet covering the flat rim. Provision is made for one of the fingers to connect to the cup. Then the device is encapsulated using one of two techniques. In the first a cap that mates with the cup is provided with a bonded insulating film cover and is bonded to the cup with its overlying metal fingers, so that a metal housing results. An encapsulating material is then injected inside the housing by way of a hole in the cap. Alternatively the semiconductor device can be covered by a suitable casting material. The active device leads can then be severed from the tape and formed into their ultimate form so that the device can be tested in tape form prior to being excised from the tape.

Claims

1. A process for encapsulating a semiconductor device that is attached to a transport tape, said tape having a succession of metal finger patterns with each pattern including a central portion where the tips of said fingers conform to the bonding pads of said semiconductor device and are bonded thereto, said process comprising the steps:

forming a metal cup, having a recess with a diameter that exceeds the size of said semiconductor device and a flat peripheral edge;

forming a first insulating film into a ring shape, having an outer diameter slightly greater than the outer diameter of said cup, and an inner diameter greater than the diameter of said semiconductor device;

bonding said first insulating film between said flat edge of said cup and said fingers on said tape;

bonding said semiconductor device to the bottom of said recess in said cup and attaching said fingers by way of said first film to said cup; and

encapsulating said semiconductor device inside said cup.

2. The process of claim 1, further including excising said fingers at a point spaced outside the outer dimension of said cup.

3. The process of claim 2, wherein said succession of finger patterns include a plurality of additional fingers that do not mate with said semiconductor device, but terminate at the inside of said flat edge and wherein said additional fingers are not excised in the step of claim 2, but serve to hold said cup in place on said tape during testing;

testing said semiconductor device; and

excising said additional fingers to remove said encapsulated device from said tape.

4. The process of claim 1 further including the step of casting an encapsulating material inside said cup to cover said semiconductor and the associated portions of said fingers.

5. The process of claim 1, further including forming a metal coverplate, having a hole therein, and a shape that will match the outer edge of said cup;

forming a second insulating film slightly larger than said plate;

bonding said second insulating film to said plate and bonding said second film and plate to said flat edge; and

injecting a potting compound through said hole inside said cup, to encapsulate said device.

6. The process of claim 3 further including the steps of fabricating an insulating carrier adapted to accommodate said encapsulated device and placing said encapsulated device on said carrier.

7. The process of claim 6, wherein said additional fingers have holes located therein, inside their excision points, and said carrier includes tapered posts that mate with said holes, whereby said encapsulated device can be secured to said carrier.

8. The process of claim 7, including the further step of excising said additional fingers at the edge of said cup, thereby to remove said encapsulated device from said carrier.

9. The process fabricated from the process of claim 1.

10. The product fabricated from the process of claim 6.