Continuous sputtering apparatus and method

• US 4,331,526 A
• Filed: 09/24/1979
• Issued: 05/25/1982
• Est. Priority Date: 09/24/1979
• Status: Expired due to Term

• Current Assignee: Coulter Systems Corporation
• Original Assignee: Coulter Systems Corporation
• Inventors: Kuehnle, Manfred R.
• Primary Examiner(s): Gantz, Delbert E.
• Assistant Examiner(s): Leader, William
• Application Number:
  US06/078,377
• Time in Patent Office: 974 Days
• Field of Search: 204/192 R, 204/298
• US Class Current: 204/192.13
• CPC Class Codes: C23C 14/562 for coating elongated substrates

Abstract

An R.F. Sputtering apparatus operable on a flexible continuous substrate. The substrate is suitable conditioned in a conditioning vessel, then passed through a sputtering vessel between spaced electrode pairs. Each pair consists of a target (cathode) and an anode. Each pair is independently energized from an r.f. source. Air locks are provided which enable substrate movement between and through the vessels without change of pressure and other physical conditions therewithin. Access doors or closures are provided over manholes which enable the targets to be serviced, replaced, etc.

Targets may be uppermost or lowermost; individual match boxes are provided for each electrode pair; heating and drive means may be provided in the main sputtering chamber; bias means may be provided for the anodes; support and/or tension controlling rollers may be provided in the sputtering chamber; and a vacuum cleaning system is provided to remove extraneous particles, dust, etc.

Claims

1. An inline continuous sputtering apparatus for sputtering insulating material onto the surface of a continuous generally planar web of flexible substrate material passing through the apparatus which comprises:

A. a source of r.f. power of megahertz frequency,

B. a sputtering vessel having grounded metallic walls defining a horizontally extending elongate sputtering chamber, there being at least top, bottom and opposite end walls,

C. first air lock means in both said opposite end walls and pump means for evacuating said first air lock means, said first air lock means isolating said sputtering chamber and together are adapted to receive and provide for the uninterrupted continuous passage of a flexible single web of substrate material into the sputtering chamber from the exterior of the sputtering chamber through one of the opposite end walls thereof and out of the sputtering chamber through the other of said opposite end walls thereof by way of said first air lock means wthout affecting the physical conditions on the interior of the chamber and without exposure to ambient air,

D. means within the chamber for supporting and guiding the web of substrate material throughout its continuous passage into, through and out of the sputtering chamber,

E. a plurality of electrode pairs in the sputtering chamber spaced horizontally one pair from the other along the length of the sputtering chamber, each electrode pair comprising a generally planar target formed of the substance to be sputtered onto the web surface and an opposed anode facing the target and having a generally conforming planar configuration and spaced from said target defining a sputtering gap, within which sputtering plasma is adapted to form, the continuous web adapted to be led through an individual sputtering plasma vapor cloud formed in each sputtering gap,

i. each target having grounded shielding surrounding the same but for its planar exposed surface which faces the anode and defines the sputtering gap therewith,

ii. each target being mounted to the walls of the sputtering vessel electrically insulated therefrom,

F. means coupling the source of r.f. power to all of the electrode pairs and including at least an individual match box coupled to each respective electrode pair for enabling efficient power transfer from the said source to the electrode pairs, each individual match box having one direct connection to the target electrode of the electrode pair it serves,

G. means for driving the web of substrate material through the chamber of the vessel in a continuous movement successively through each plasma vapor cloud in each sputtering gap,

H. means for connecting the anode of each electrode pair to substantially ground potential, and

I. means cooperating with said r.f. power source and electrode pairs for establishing a sputtering condition within all said gaps.

2. The sputtering apparatus as claimed in claim 1 in which the targets are arranged in the chamber with all of the exposed surfaces facing downward and the cooperating anode surface facing upward such that the web will pass over the anode surfaces during its movement.

3. The sputtering apparatus as claimed in claim 1 in which the targets are arranged in the chamber with all of the exposed surfaces facing upward and the cooperating anode surfaces facing downward, said supporting and guiding means being effective to maintain said gaps with the web spaced from the targets during its passage through said chamber.

4. The sputtering apparatus as claimed in claim 1 in which there is a manhole in the walls of the vessel in the vicinity of each pair of electrodes to enable access to said electrodes and removable closures for sealing each respective manhole during sputtering operation of the apparatus.

5. The sputtering apparatus as claimed in claim 1 in which there is a manhole in at least one of said top and bottom walls of the vessel in the vicinity of each pair of electrodes to enable access to said electrodes and a separate removable closure for sealing each respective manhole during sputtering operation of the apparatus.

6. The sputtering apparatus as claimed in claim 1 in which there is a manhole in the top wall of the vessel in the vicinity of each pair of electrodes to enable access to said electrodes and a separate removable closure for sealing each respective manhole during sputtering operation of the apparatus.

7. The sputtering apparatus as claimed in claim 6 in which each target is mounted on the bottom of an individual closure, the said individual closure being hinged along an edge thereof so that the said individual closure swings relative to said top wall upon removal, carrying its mounted target out of the chamber and giving direct access thereto.

8. The sputtering apparatus as claimed in claim 7 in which the said match box individual to each target is also mounted to the said individual closure which mounts said target served by said match box.

9. The sputtering apparatus as claimed in claim 7 in which means are provided on each individual closure to adjust the physical disposition of the said target carried thereby.

10. The sputtering apparatus as claimed in claim 7 in which said means cooperating with said r.f. source and electrode pairs comprise structure for introducing background sputtering gas to said chamber and there is a respective conduit for said gas leading to each said individual closure such that the gas will pass into the chamber in proximity to the target carried by said individual closure.

11. The apparatus as claimed in claim 1 in which said apparatus includes tension control means for maintaining uniform tension in said web during its passage through the apparatus.

12. The apparatus as claimed in claim 1 in which means are provided for sputter etching the web before it enters said gaps.

13. The apparatus as claimed in claim 1 and a cleaning station arranged adjacent said one end of the chamber and comprising a separate cleaning vessel through which the web passes prior to entering the sputtering vessel, said separate cleaning vessel having an entrance end and an exit end, second air lock means at said entrance end and pump means therefor, said first air lock means coupling said exit end to said sputtering chamber at the entrance to said sputtering chamber, sputter etching means disposed within said separate cleaning vessel and being electrically isolated from said respective spaced electrode pairs which define said sputtering gaps whereby the web passes directly from said cleaning station to the sputtering chamber of the sputtering vessel without entering the ambient atmosphere.

14. The apparatus as claimed in claim 1 in which web-cleaning means are contained within the sputtering chamber and located adjacent the entrance thereof whereby the web will pass said last means for cleaning before passing into said sputtering gaps.

15. The apparatus as claimed in claim 1 and means establishing selective access to said electrodes and track means, carriage means ridable on said track means and raising and lowering means mounted on said carriage means for facilitating changing of said targets through said access means.

16. The apparatus as claimed in claim 1 and vacuum exhaust means coupled to said apparatus in communication with the interior thereof for removing any contaminants therein and said vacuum exhaust means includes carrier and guide means arranged for disposition proximate said interior, vacuum nozzle means carried by said carrier and guide means, a source of vacuum and conduit means coupling said nozzle to said vacuum source.

17. The apparatus as claimed in claim 16 and said nozzle means being capable of movement in a sweeping motion along the length of said apparatus.

18. An inline continuous sputtering apparatus for sputtering insulating material onto the surface of a continuous web of flexible substrate material passing through the apparatus from an exterior supply thereof to an exterior take-up therefor, said apparatus comprising:

A. an exterior supply of flexible substrate material and an exterior take-up therefor,

B. a source of r.f. power of megahertz frequency,

C. a sputtering vessel having grounded metallic walls defining a horizontally extending elongate sputtering chamber, there being at least top, bottom and opposite end walls,

D. sputtering air lock means in the opposite end walls of said sputtering vessel defining an entrance and an exit therefor and pump means for evacuating said air lock means, said air lock means and sputtering chamber coacting to isolate the sputtering chamber, same being adapated to receive and provide for continuous passage of the web of flexible substrate material from the exterior supply into the sputtering chamber at said entrance and out of the sputtering chamber at said exit and for receipt by the exterior take-up without affecting the physical conditions on the interior of the chamber,

E. support and guide means within the sputtering chamber for supporting and guiding the web of flexible substrate material during its continuous passage horizontally into, through and out of each sputtering gap in said sputtering chamber,

F. plural electrode pairs, each electrode pair comprising a target formed of the material to be deposited onto the web and an opposed anode facing the target and having a generally conforming configuration and spaced from said target thereby defining a sputtering gap, said electrode pairs being disposed within said sputtering vessel spaced horizontally along the length of the sputtering chamber and providing successive horizontally spaced sputtering gaps through which the web passes and the electrode pairs being coupled to said source of r.f. power generating successive horizontally spaced individual plasma vapor clouds in each respective sputtering gap,

G. a web conditioning vessel having opposite first and second end walls, means defining an entrance through said first end wall of the web conditioning vessel, means defining an exit through the second end wall of said web conditioning vessel, means for leading the web through said entrance, through said conditioning vessel and out the exit thereof to the sputtering vessel, the web being capable of being conditioned within said conditioning vessel during transit therethrough,

H. conditioning vessel air lock means in said first end wall of said conditioning vessel and pump means therefor, the second end wall of said conditioning vessel being juxtaposed relative to the entrance end of said sputtering vessel, said sputtering vessel air lock means being coupled to said exit of said web conditioning vessel at the entrance to said sputtering chamber whereby to enable passage of said web from the conditioning vessel to said sputtering chamber without entering the ambient atmosphere surrounding the apparatus,

I. means for driving the web continuously through said conditioning vessel and through the successive horizontally spaced sputtering gaps and the plasma vapor clouds therewithin the sputtering vessel and

J. means cooperating with said r.f. power source and electrode pairs for establishing the respective sputtering conditions within said sputtering gaps.

19. The apparatus as claimed in claim 18 in which there are tension control means for maintaining uniform tension in said web during its passage through said apparatus.

20. The apparatus as claimed in claim 19 in which said tension control means include a vessel in alignment with said conditioning and sputtering vessels such that the web passes through the tension control vessel and air locks are provided at the entrance and exit of said tension control vessel to prevent contamination of said web while passing through, there being pump means serving said last mentioned air locks.

21. The apparatus as claimed in claim 19 in which there is a servo system including driving and sensing means within the sputtering chamber along the length of said web while passing through the chamber cooperating with said tension control means, there being feed back means connected between said driving and sensing means and tension control means.

22. A method of sputtering a sputterable material onto a continuously moving flexible web of substrate material from an exterior supply to an exterior take-up, said method comprising the steps of

A. preconditioning the web while moving the same horizontally from the supply through ambient air into an enclosed chamber where the preconditioning occurs,

B. driving the web from said enclosed chamber in a continuous movement through a plurality of sputtering plasma clouds spaced horizontally apart within a second enclosed chamber, each plasma cloud being formed between an electrode pair comprising a target formed of the material to be deposited onto the web and an opposed anode facing the target and having a generally conforming configuration and spaced from said target thereby defining a sputtering gap,

C. Locking the chambers and web from the ambient air while the web passes through said chambers and between chambers, but permitting passage thereof,

D. maintaining uniform r.f. sputtering conditions along with the establishment of said plasma clouds whereby to apply a coating of sputtered material upon a surface of said web as it passes through said sputtering gaps,

E. passing said web in coated condition out of said sputtering chamber and accumulating the same on the take-up.

23. The method as claimed in claim 22 in which a bias is applied during sputtering.

24. The method as claimed in claim 22 in which constant tension is maintained on said web while moving through said chambers.

25. The method as claimed in claim 22 in which a plurality of coatings of different materials are applied successively to said web while moving through said chambers.

26. The method as claimed in claim 22 in which the web is sputter etched prior to the first coating application.

27. The method of sputtering a sputterable material onto a moving flexible web of substrate material from an exterior supply to an exterior take-up comprising the steps of:

A. cleaning the web while moving the same horizontally from the exterior supply through ambient air into an enclosed cleaning chamber where cleaning occurs,

B. driving the web from said enclosed chamber in a continuous movement from the cleaning chamber without exposure to ambient air into a second enclosed chamber,

C. sputter-etching the web while passing same through said second enclosed chamber,

D. driving the web from said second enclosed chamber to a third enclosed chamber without exposure to ambient air and passing the web in a continuous movement through at least a pair of horizontally spaced sputtering plasma vapor clouds formed within said third enclosed chamber, each plasma vapor cloud being formed between an electrode pair comprising a target formed of the material to be deposited onto the web and an opposed anode facing the target and having a generally conforming configuration and spaced from said target thereby defining a sputtering gap,

E. r.f. sputtering a coating of sputterable material on the web while passing the web successively through the spaced sputtering plasma vapor clouds within said third enclosed chamber,

F. air-locking the passages to and from said chamber from ambient air enabling passage of the web through and between said chambers without exposure to ambient air and

G. passing the web in its coated condition from the third enclosed chamber through an air-lock and accumulating the coated web on a take-up located exterior of said apparatus.

28. The method as claimed in claim 27 in which additional sputtering plasma vapor clouds are established in separate chambers, the chambers being arranged in sequence.

29. The method as claimed in claim 27 in which plural successive coating layers of different materials are applied after sputter etching.