Gang bonding interconnect tape process and structure for semiconductor device automatic assembly

• US 4,331,740 A
• Filed: 04/14/1980
• Issued: 05/25/1982
• Est. Priority Date: 04/14/1980
• Status: Expired due to Term

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Burns, Carmen D.
• Primary Examiner(s): Husar, Francis S.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US06/140,040
• Time in Patent Office: 771 Days
• Field of Search: 29/827, 29/577 R, 29/854, 29/855, 29/856, 29/588, 29/589, 357/69, 357/70, 174/52 FP, 228/180 A, 428/571, 428/572, 428/596, 428/597
• US Class Current: 428/572
• CPC Class Codes: H01L 2224/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01043 Technetium [Tc]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 428/12194 For severing perpendicular to longitudinal dimension

Abstract

A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers. If desired, the ring structure can be weakened at those points where it is to be severed.

Claims

1. A tape for the automatic assembly of semiconductor devices having a bonding pad array that is to be interconnected with elements of a secondary lead array, said tape including a plurality of sequential metal finger patterns comprising:

inwardly extending portions that form an array that mates with said bonding pad array;

outwardly extending portions that form an array that mates with said secondary lead array; and

a metal ring joining said fingers together to form a unitary structure, said ring including weakened points between said fingers.

2. The tape of claim 1 where said ring is located on said fingers at the point where they are to be bonded to said secondary lead array.

3. The tape of claim 1 wherein said ring is located on said fingers at a point inside the point where they are to be bonded to said secondary lead array.

4. The tape of claim 1 in combination with said semiconductor device.

5. The tape of claim 4 in combination with said secondary lead array.

7. The process of claim 1 wherein said tape is of all metal construction.

6. A tape process for assembling semiconductor devices wherein said tape includes a series of sequential metal finger patterns, each pattern including a plurality of fingers extending inwardly to form an array that mates with the contact pattern of a semiconductor device, said fingers also extending outwardly to form an array that mates with a secondary lead pattern that will serve to connect said semiconductor device to external circuitry, said process including the steps of:

forming a ring of metal integral with said fingers to join said fingers into a unitary structure;

thinning said ring at points intermediate between said fingers;

bonding said fingers to said semiconductor device;

excising said fingers from said tape at a location outside said ring;

bonding said fingers to said secondary lead pattern;

then severing said ring at said thinned points between said fingers; and

lastly,

encapsulating said semiconductor device along with said fingers and portions of said secondary lead pattern.

8. The process of claim 6 wherein said tape is of composite construction including an insulating backing with metal portions including said finger patterns located thereon.

9. The process of claim 6 wherein said severing is achieved by pressing a knife blade against said ring and using said secondary lead pattern as a backing for said knife blade.