Liquid or pasty thermosetting adhesive which can be pre-gelled and which is based on epoxide resin, and the use of this adhesive
First Claim
1. A liquid or pasty thermosetting adhesive, which can be pre-gelled and which is based on epoxide resin, which consists essentially of(a) a liquid epoxide resin having on average more than one epoxide group in the molecule or a mixture of said liquid epoxide resins,(b) an effective amount of a latent curing agent for epoxide resin, which is insoluble in the epoxide resin at room temperature, and which is selected from the group consisting of dicyandiamide, melamine, guanamine, polycarboxylic acid polyhydrazides, carboxylic acid imides and imidazole derivatives, and(c) 5 to 50% by weight, relative to the epoxide resin, of at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which thermoplast has a softening point of between 60°
- and 160°
C.
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Accused Products
Abstract
A liquid or pasty thermosetting adhesive which can be pre-gelled, which is suitable for the bonding of moulded parts or for the sealing of folded seams, and which contains (a) a liquid epoxide resin having on average more than one epoxide group in the molecule, and (b) a latent epoxide curing agent insoluble in the epoxide resin, the adhesive being characterized in that it also contains (c) in an amount of 5 to 50 percent by weight relative to the epoxide resin, at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which has a softening point of between 60° and 160° C., such as a polyethylene, a polypropylene or an ethylene/acrylic acid/acrylate terpolymer.
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Citations
9 Claims
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1. A liquid or pasty thermosetting adhesive, which can be pre-gelled and which is based on epoxide resin, which consists essentially of
(a) a liquid epoxide resin having on average more than one epoxide group in the molecule or a mixture of said liquid epoxide resins, (b) an effective amount of a latent curing agent for epoxide resin, which is insoluble in the epoxide resin at room temperature, and which is selected from the group consisting of dicyandiamide, melamine, guanamine, polycarboxylic acid polyhydrazides, carboxylic acid imides and imidazole derivatives, and (c) 5 to 50% by weight, relative to the epoxide resin, of at least one halogen-free thermoplast in powder form, which is insoluble in the epoxide resin at room temperature, and which thermoplast has a softening point of between 60° - and 160°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- and 160°
Specification