Control panel assembly

• US 4,336,569 A
• Filed: 06/25/1979
• Issued: 06/22/1982
• Est. Priority Date: 06/26/1978
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Tsuda, Tatsuya, Ohno, Yoshikatsu
• Primary Examiner(s): GRIMLEY, ARTHUR
• Application Number:
  US06/051,393
• Time in Patent Office: 1,093 Days
• Field of Search: 219/10.55 B, 219/10.55 R, 361/401, 361/397, 361/399, 361/395, 361/358, 200/292, 200/DIG. 1
• US Class Current: 361/736
• CPC Class Codes: F24C 15/006 Arrangements for circulation of cooling air
• CPC Class Codes: F24C 7/082 on ranges, e.g. control panels, illumination
• CPC Class Codes: H05B 6/642 Cooling of the microwave components and related air circulation systems H05B6/6473 takes precedence
• CPC Class Codes: H05B 6/6435 Aspects relating to the user interface of the microwave heating apparatus

Abstract

A control panel assembly adapted for controlling operation of a cooking utensil comprises a control panel, a printed wiring board forming a back surface of the control panel assembly, and circuit elements including a semiconductor chip device arranged on the printed wiring board. Virtually all the bodies of the circuit elements are mounted on a first surface of the printed wiring board. The first surface is opposite to a heating source for the cooking utensil. Virtually all electric connectors for the circuit elements are supported on a second surface of the printed wiring board, the second surface facing the heating source. With such a construction, the second surface including the electric connectors, namely, the back surface of the control panel assembly is substantially flat and non-rugged.

Claims

1. A control unit for controlling the operation of a cooking utensil, comprising:

a panel forming a front surface of the control unit and having a control means disposed thereon for introducing control instructions into said cooking utensil;

a printed wiring board forming a back surface of the control unit, said printed wiring board including circuit elements and a semiconductor chip device arranged thereon,

said circuit elements and said semiconductor chip device being mounted on a first surface of the printed wiring board, the first surface facing the interior portion of the control unit; and

electrical connectors connecting the circuit elements and the semiconductor chip device together, said electrical connectors being supported on a second surface of the printed wiring board, the second surface being an opposite surface relative to the first surface and being an exterior surface of said control unit on the back surface thereof,

the second surface being substantially flat.

2. The control unit according to claim 1, further comprising test terminal connected to the electrical connectors on the second surface of the printed wiring board.

3. The control unit according to claim 1, wherein the semiconductor chip device comprises a body and terminals connected thereto, the body of the semiconductor chip device being mounted on the first surface of the printed wiring board, the terminals of the semiconductor chip device penetrating the printed wiring board and extending therethrough to the second surface thereof.

4. The control unit according to claim 1, wherein the semiconductor chip device includes a body and terminals connected thereto, and wherein the printed wiring board includes an opening disposed therethrough for accommodating the body of the semiconductor chip device, the body being disposed adjacent the first surface of the printed wiring board, and the terminals of the semiconductor chip device being adhered to the electrical connectors formed on the second surface of the printed wiring board.

5. The control unit according to claim 3 or 4, wherein the panel is spaced a certain distance from the printed wiring board, forming a space therebetween whereby an air flow passes through the space for cooling the body of said semiconductor chip device.