Hard gold surfaces

• US 4,337,133 A
• Filed: 12/18/1980
• Issued: 06/29/1982
• Est. Priority Date: 06/20/1979
• Status: Expired due to Term

• Current Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Original Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Inventors: Augis, Jacques A., Lo, Christopher C. C.
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US06/217,914
• Time in Patent Office: 558 Days
• Field of Search: 204/192 C, 204/43 G
• US Class Current: 204/192.17
• CPC Class Codes: A44C 27/00 Making jewellery or other personal adornments
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: H01H 1/023 having a noble metal as the basic material

Abstract

A process is described for making hard gold films suitable for electrical contact surfaces. A particular advantage of these films is that they operate well at high temperatures without forming resistive films on the contact surface.

Claims

1. A process for fabricating an electrical contact with at least one hard metallic film with Vickers Hardness Numbers greater than 100 on a substrate, said metallic film comprising gold, comprising the step of sputtering a gold alloy composition onto the substrate using a carrier gas characterized in that the gold alloy composition consists essentially of between 0.05 and 5 weight percent noble refractory metal remainder gold, said noble refractory metal consisting essentially of at least one element selected from the group consisting of rhodium and ruthenium and the substrate is maintained at a temperature below 80 degrees C. during the sputtering procedure.

2. The process of claim 1 in which the amount of noble refractory metal is between 0.1 and 3.0 weight percent.

3. The process of claim 2 in which the amount of noble refractory metal between 0.2 and 0.8 weight percent.

4. The process of claim 1 in which argon is used as the carrier gas.

5. The process of claim 4 in which the pressure of the carrier gas is between 1 and 50 millitorrs.

6. The process of claim 1 in which the substrate is maintained at a temperature below 50 degrees C.