Method for increasing the peel strength of metal-clad polymers

• US 4,337,279 A
• Filed: 01/23/1981
• Issued: 06/29/1982
• Est. Priority Date: 01/23/1981
• Status: Expired due to Fees

• Current Assignee: UOP Llc (Honeywell International Inc.)
• Original Assignee: UOP Llc (Honeywell International Inc.)
• Inventors: Polak, Anthony J.
• Primary Examiner(s): Lusignan, Michael R.
• Application Number:
  US06/228,019
• Time in Patent Office: 522 Days
• Field of Search: 427/40, 427/304, 427/322, 204/159.15, 204/159.22, 428/461, 428/462
• US Class Current: 427/537
• CPC Class Codes: C08J 7/123 Treatment by wave energy or particle radiation C08J7/18 takes precedence
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 18/2066 Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
• CPC Class Codes: H05K 1/0333 containing S
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31696 Including polyene monomers [e.g., butadiene, etc.]

Abstract

The peel strength of metal-clad polymers may be increased by treating a polymer such as polysulfone with a gas plasma prior to the deposition of the metal thereon. The gas plasma is provided for by the introduction of a gas such as helium, argon, etc. over the surface of the polymer while said polymer is in an electric field in which the power may range from about 50 to about 15,000 watts.

Claims

1. A process for increasing the peel strength of a metal-clad polysulfone polymer which comprises subjecting said polysulfone polymer to a gas plasma comprising the presence of a treatment gas and an electrical field generated from an electrical power of from about 50 to about 15000 watts, at a temperature of from about ambient to about the glass transition temperature of said polysulfone polymer and a pressure in the range of from about 5 atmospheres to about 10^-6 torr for a period of time ranging from about 5 minutes to about 4 hours and thereafter depositing a metal on the resultant treated polysulfone polymer and thereafter recovering the metal-clad polysulfone polymer possessing increased peel strength.

2. The process as set forth in claim 1 in which the treatment gas in said gas plasma is helium.

3. The process as set forth in claim 1 in which the treatment gas in said plasma is argon.

4. The process as set forth in claim 1 in which the treatment gas in said gas plasma is nitrogen.

5. The process as set forth in claim 1 in which the treatment gas in said gas plasma is carbon tetrafluoride.

6. The process as set forth in claim 1 in which said metal is copper.

7. The process as set forth in claim 1 in which said metal is brass.

8. The process as set forth in claim 1 in which said metal is nickel.

9. The process as set forth in claim 1 in which said metal is aluminum.

10. The process as set forth in claim 1 in which said metal is zinc.